Semiconductor Device Ceramic Substrate Warpage Reduction
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional semiconductor device manufacturing methods using glass epoxy substrates face challenges such as warpage due to heat, leading to reduced yield and increased manufacturing costs, and the need for multiple redistribution layers results in higher device height and complexity.
Innovation Solution
A semiconductor device design featuring a semiconductor chip with a bump electrode, a molding portion, a single redistribution layer, and an outer connection electrode, where the bump electrode is exposed and the redistribution layer is electrically coupled to both the chip and the outer connection electrode, reducing the number of components and device height.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a large area glass epoxy substrate is used to increase the quantity of semiconductor chips per substrate, then manufacturing cost is reduced, but the substrate warps due to heat generated during molding, reducing yield and reliability
Solution Approach 1:
The patent changes the material parameter of the substrate from glass epoxy to ceramic, which has superior thermal stability and resistance to warping. This material substitution resolves the contradiction by maintaining substrate integrity during high-temperature molding processes, enabling the use of large area substrates without warpage issues while keeping manufacturing costs low through high chip density.
2Reliability
If two redistribution layers are used to connect outer connection electrodes to semiconductor chips, then electrical connection is achieved, but device height increases and manufacturing complexity increases
Solution Approach 1:
The patent merges the functions of multiple redistribution layers into a single redistribution layer that directly connects the outer connection electrodes to the semiconductor chips. This consolidation reduces the number of layers from two to one, decreasing device height and manufacturing complexity while maintaining reliable electrical connections through optimized layer design.
3Strength
If a glass epoxy substrate of certain thickness is used to support flip-chip mounting, then mechanical strength is sufficient, but the height of the semiconductor device cannot be reduced below approximately 1 mm
Solution Approach 1:
The patent changes the substrate material from glass epoxy to ceramic, which provides superior mechanical strength and stiffness. This enables the use of thinner substrates that can still support flip-chip mounting, thereby reducing the overall device height below the 1 mm limitation imposed by glass epoxy substrates while maintaining adequate mechanical strength.
4Reliability
If a recess is formed on a ceramics substrate to implant a semiconductor chip, then chip mounting is achieved, but manufacturing cost increases
Solution Approach 1:
The patent extracts the recess formation step from the manufacturing process by using a flat ceramics substrate without recesses. The semiconductor chips are mounted directly on the flat surface, eliminating the need for costly recess formation processes while maintaining reliable chip mounting through the inherent properties of the ceramic substrate and optimized mounting structure.
Data Source
AI summary
A semiconductor device includes a semiconductor chip, a bump contract, and encapsulating layer, an insulating layer, and a connection terminal.