Semiconductor Chip Bending via Sliding Edge Constraints
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Solution Overview
Problem
Existing methods for shaping semiconductor chips, such as photonic sensors, often result in high internal stresses due to rigid constraint of edges or corners, limiting the achievable curvature and increasing the risk of fracture during bending.
Innovation Solution
A method where the semiconductor chip is placed in a concave mold allowing edges or corners to slide and move, reducing tension and enabling greater deflection by distributing force uniformly across the chip, thereby reducing the risk of fracture and allowing for more significant curvature without rigid constraint.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If edges or corners of the semiconductor chip are rigidly constrained during bending, then the chip maintains positional stability, but high internal stresses and tension occur increasing the risk of fracture
Solution Approach 1:
The patent transitions from static rigid constraints to dynamic sliding constraints. The mold allows edges or corners to slide along the mold surface during bending, enabling the chip to adapt its position dynamically. This reduces stress concentration while maintaining control over the bending process, resolving the contradiction between positional stability and stress reduction.
Solution Approach 2:
The patent changes the constraint parameter from fixed/rigid to movable/sliding. By allowing edges or corners to slide on the mold surface, the constraint becomes adaptable rather than rigid. This parameter change enables stress distribution throughout the bending process while maintaining sufficient control to achieve the desired curvature without fracture.
2Shape
If edges or corners are fixed in position during bending, then the chip remains stable, but the achievable curvature is limited due to high tension
Solution Approach 1:
The sliding constraint allows the chip to dynamically adjust its edge positions during bending, enabling greater deflection and curvature. The dynamic nature of the constraint permits the chip to accommodate the stresses associated with higher curvature without exceeding its tensile strength limits.
Solution Approach 2:
The patent uses a mold with the desired curved shape as a template. By allowing the chip to bend over this mold with sliding constraints, the chip copies the mold's curvature profile. The sliding mechanism enables the chip to achieve this copied shape without the tensile stresses that would occur with rigid constraints.
3Force
If uniform pressure is applied to bend the chip, then the bending force is distributed, but edges or corners may still experience high stress if constrained
Solution Approach 1:
The sliding constraint at edges or corners allows these regions to move dynamically in response to applied pressure. When uniform pressure is applied to the chip surface, the sliding mechanism prevents stress concentration at edges by allowing them to adjust their position, distributing the forces more evenly throughout the chip structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for more substantial bending deflections and reduces internal stresses, enabling the formation of curved shapes like spherical or aspheric surfaces on photonic sensor chips, improving optical system performance by reducing tension and preventing catastrophic failure.
Implementation Method 1
the semiconductor chip is bent into the shape of the concave mold... allowing the edges or corners to move or slide on the surface of the concave mold as the semiconductor chip is bent
Data Source
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AI summary
Techniques for fabricating a semiconductor chip having a curved surface may include placing a substantially flat semiconductor chip in a recess surface of a concave mold such that corners or edges of the semiconductor chip are unconstrained or are the only portions of the semiconductor chip in physical contact with the concave mold; and bending the substantially flat semiconductor chip to form a concave shaped semiconductor chip by applying a force on the semiconductor chip toward the bottom of the recessed surface. The corners or edges of the semiconductor chip move or slide relative to the recess surface during the bending.