Semiconductor Chip ESD Protection via Ground Bus Electrode Pad

Solution Overview

Problem

Existing semiconductor chip designs face challenges in providing effective electrostatic discharge (ESD) protection between multiple chip packages without wasting chip area, as electrode pads and protection circuits are unnecessary when the chip is not used in Multi-Chip Packages (MCP).

Innovation Solution

Incorporating a protective electrode pad electrically connected to the ground bus line in a region where active electrode pads cannot be provided, and an ESD protection circuit between the protective electrode pad and the ground bus line, allowing for ESD protection between semiconductor chips without increasing chip area.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If electrode pads and protection circuits are provided on semiconductor chips for ESD protection in MCP applications, then ESD protection between multiple semiconductor chips is improved, but chip area is wasted when the chip is not used with MCP

Engineering Contradiction:

ImproveESD protectionVSAvoidchip area

Core Design Contradiction:

ReliabilityVSArea of stationary object

Solution Approach 1:

The electrode pad is designed to serve dual purposes: it functions as a signal electrode pad for normal chip operations and as an ESD protection electrode pad when connected to ground bus lines in MCP applications. This multi-functionality eliminates the need for separate ESD protection components, thereby preventing chip area waste while maintaining ESD protection capability.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Solution Approach 2:

The existing electrode pad structure serves itself by being electrically connected to ground bus lines through the connection structure. This self-service mechanism enables the electrode pad to provide ESD protection without requiring additional dedicated ESD protection circuits or components, thus avoiding chip area waste while ensuring reliability.

Inventive Principle:

Principle #25Self-service

2Reliability

If dedicated ESD protection circuits are added to semiconductor chips, then ESD protection between multiple chips is improved, but device complexity increases

Engineering Contradiction:

ImproveESD protectionVSAvoidcircuit complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The electrode pad is designed to serve dual purposes: it functions as a signal electrode pad for normal chip operations and as an ESD protection electrode pad when connected to ground bus lines in MCP applications. This multi-functionality eliminates the need for separate ESD protection components, thereby preventing chip area waste while maintaining ESD protection capability.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Solution Approach 2:

The existing electrode pad structure serves itself by being electrically connected to ground bus lines through the connection structure. This self-service mechanism enables the electrode pad to provide ESD protection without requiring additional dedicated ESD protection circuits or components, thus avoiding chip area waste and circuit complexity.

Inventive Principle:

Principle #25Self-service

3Area of stationary object

If electrode pads are placed in regions where active electrode pads cannot be provided, then chip area utilization is improved, but electrical signal transmission may be affected

Engineering Contradiction:

Improvechip area utilizationVSAvoidsignal transmission

Core Design Contradiction:

Area of stationary objectVSReliability

Solution Approach 1:

The electrode pad is strategically positioned in a specific region of the chip where active electrode pads cannot be provided. This location is optimized to serve ESD protection functions without interfering with signal transmission regions. The pad is electrically connected to ground bus lines through connection structures that maintain signal integrity while enabling ESD protection in the designated area.

Inventive Principle:

Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution enables ESD protection between multiple semiconductor chips without occupying additional chip area, ensuring effective protection even when the chip is not adapted for MCP, and minimizes the impact of noise between chips.

Implementation Method 1

a first protective pad electrode pad electrically connected to a ground bus line of the semiconductor chip in a region where an active electrode pad, which gives and receives electric signals necessary for operation of the internal circuit, cannot be provided

Methodology Applied

Scientific EffectElectrostatic Discharge: Electrostatic Discharge

Data Source

PatentUS8093629B2Semiconductor chip and semiconductor device having a plurality of semiconductor chips

Publication Date: 2012.01.10 LAPIS SEMICON CO LTD

AI summary

The present invention comprises a semiconductor chip, and a semiconductor device having a plurality of semiconductor chips, that enables ESD protection from another semiconductor chip without increasing the chip area in case the semiconductor chip is Multi-Chip-Packaged, without wasting chip area in case the semiconductor chip is not Multi-Chip-Packaged. The exemplary semiconductor chip of the present invention includes an internal circuit and a first electrode pad electrically connected to a ground bus line of the first semiconductor chip in a region where an electrode pad, which gives and receives electric signals required for an operation of the internal circuit, cannot be provided.