Semiconductor Chip Lateral Composition Gradient Multi-Wavelength
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Solution Overview
Problem
Current laser diode technologies require multiple laser sources with different wavelengths for applications like projection and bio-sensing, leading to high logistical costs and assembly complexities due to the need for individual diodes, heat sinks, and optics adjustments, which restricts compactness and increases production costs.
Innovation Solution
A light-emitting semiconductor chip with a first semiconductor layer having a lateral variation in material composition, achieved through an inhomogeneous temperature distribution during growth, allowing for multiple emission wavelengths within a single chip, reducing the need for multiple diodes and simplifying assembly.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple laser diodes with different wavelengths are selected and assembled individually, then the required emission wavelengths are achieved, but the assembly complexity and logistical outlay increase significantly
Solution Approach 1:
The patent merges multiple laser diode functions into a single semiconductor chip by creating laterally adjacent regions with different material compositions during the growth process. This allows multiple emission wavelengths to be generated from one integrated structure, eliminating the need to assemble multiple separate diodes and their associated heat sinks, bond wires, and housings.
Solution Approach 2:
The invention applies local quality by creating laterally adjacent regions within the semiconductor chip that have different material compositions (e.g., different InAlGaN or InAlGaP compositions). Each region is optimized for a specific emission wavelength, allowing the single chip to provide multiple wavelengths with locally tailored properties.
2Adaptability or versatility
If multiple individual laser diodes are assembled with separate heat sinks and optics, then the required wavelengths are provided, but the minimum size is sharply restricted and compactness is impaired
Solution Approach 1:
The patent combines multiple laser diode functions into a single semiconductor chip with laterally adjacent regions. This integration dramatically reduces the overall device volume by eliminating the need for separate heat sinks, bond wires, housings, and optical alignment components that would be required for multiple individual diodes.
Solution Approach 2:
The semiconductor chip achieves multi-functionality by incorporating laterally adjacent regions with different material compositions that emit at different wavelengths. This single universal component can provide multiple emission wavelengths (e.g., blue, cyan, green, yellow-green) that would otherwise require multiple separate laser diodes.
3Manufacturing precision
If laser diodes are assembled individually with adjustable optics, then the required emission characteristics are achieved, but the assembly costs increase and yields are impaired
Solution Approach 1:
The invention merges multiple laser diode functions into a single semiconductor chip with laterally adjacent regions. This integration eliminates the need for individual optics adjustment for each diode, as all emission regions are fixed in their relative positions during the growth process. The single-chip structure allows for standardized assembly procedures, improving yields and reducing assembly costs.
4Adaptability or versatility
If various laser diodes with different wavelengths are selected and soldered on individually, then the required emission wavelengths are achieved, but the yield is reduced due to rejection of diodes with unsuitable wavelengths
Solution Approach 1:
The invention creates laterally adjacent regions with different material compositions during the semiconductor layer growth process. By controlling the local material composition (e.g., varying InAlGaN or InAlGaP ratios) in different lateral regions, the chip is designed to emit at different wavelengths from the outset. This eliminates the need to reject diodes with unsuitable wavelengths, as all wavelength variations are intentionally built into the single chip structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables compact, multi-wavelength emission within a single semiconductor chip, reducing assembly complexity and costs while improving yield and imaging quality by integrating multiple laser strips with different wavelengths, allowing for speckle reduction and efficient wavelength control.
Implementation Method 1
during the growth process for growing the first semiconductor layer, an inhomogeneous temperature distribution is created along at least one direction of extent of the growing first semiconductor layer, such that a lateral variation of a material composition of the first semiconductor layer is produced
Data Source
AI summary
A light-emitting semiconductor chip (100) is provided, having a first semiconductor layer (1), which is at least part of an active layer provided for generating light and which has a lateral variation of a material composition along at least one direction of extent. Additionally provided is a method for producing a semiconductor chip (100).