Semiconductor Chip Package with Segmented I/O Connections
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Solution Overview
Problem
Conventional semiconductor chip packages face limitations in input/output connections, with lead frame-based packages having limited connections and higher costs, while ball grid array (BGA) packages offer more connections but suffer from poorer yields and higher fabrication costs due to additional electrical connections.
Innovation Solution
A semiconductor chip package design that incorporates a lead frame with a chip carrier and a package substrate, where the chip carrier has a smaller area than the semiconductor chip, and the package substrate has a larger area, allowing for increased input/output connections through bonding pads and leads, with the package substrate also serving as a heat sink and providing additional electrical connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If a ball grid array (BGA) semiconductor package is used to provide a greater amount of input/output connections, then the amount of input/output connections is improved, but the manufacturing precision and reliability deteriorate due to poorer yields
Solution Approach 1:
The patent divides the bonding pads into two groups: some bonding pads are electrically connected to the package substrate while remaining bonding pads are electrically connected to the leads. This segmentation allows the package to achieve increased I/O connections through the package substrate without requiring all connections to go through the complex BGA solder ball process, thereby improving yields while maintaining high connection counts.
2Quantity of substance
If a ball grid array (BGA) semiconductor package is used to provide a greater amount of input/output connections, then the amount of input/output connections is improved, but the fabrication cost increases
Solution Approach 1:
The patent segments the electrical connection paths by connecting only some bonding pads to the package substrate while leaving other bonding pads connected to leads. This reduces the complexity and cost of the package substrate interconnections compared to a full BGA implementation, achieving a cost-effective balance between connection count and manufacturing complexity.
3Ease of manufacture
If conventional lead frame based semiconductor package is used, then the fabrication cost is reduced, but the amount of input/output connections is limited
Solution Approach 1:
The patent merges the advantages of both lead frame and BGA packages by combining the simple, cost-effective lead frame structure with a package substrate that provides additional I/O connections. The lead frame provides basic structural support and some electrical connections, while the package substrate adds additional connection capacity, achieving a balance between cost and connection count.
4Area of stationary object
If the chip carrier has an area smaller than the semiconductor chip, then the packaging efficiency is improved, but the electrical connection complexity increases
Solution Approach 1:
The patent resolves the connection complexity issue by utilizing the package substrate as an intermediate platform that provides additional connection points. Instead of requiring all connections to be made directly from the small chip carrier, the package substrate extends the connection architecture in another dimension, allowing bonding pads to connect to either the substrate or leads based on their function.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances input/output connections, reduces fabrication costs, and improves yields by allowing for simpler layout and reduced bonding wire lengths, while providing improved thermal management and electrical performance.
Implementation Method 1
the package substrate also serving as a heat sink
Data Source
AI summary
A semiconductor chip package comprises a lead frame having a chip carrier having a first surface and an opposite second surface. A first semiconductor chip is mounted on the first surface, having a plurality of bonding pads thereon, wherein the first semiconductor chip has an area larger that that of the chip carrier. A package substrate has a central region attached to the second surface of the chip carrier, having an area larger than that of the first semiconductor chip, wherein the package substrate comprises a plurality of fingers on a top surface thereof in a marginal region of the package substrate, which are arranged in an array with a row of inner fingers adjacent to the first semiconductor chip and a row of outer fingers adjacent to an edge of the package substrate, wherein the inner and outer fingers are electrically connected to the bonding pads of the first semiconductor chip and the lead frame respectively.