Semiconductor Package Clip Pillar Solder Ball Design
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Solution Overview
Problem
The use of single areas of solder for coupling components in semiconductor packages often results in significant and random solder bleed, leading to shorting between adjacent components.
Innovation Solution
A clip design featuring a planar portion, pillars, and solder balls is used to electrically couple components, where the pillars are coupled to the planar portions and the solder balls are attached to the pillars, allowing for controlled reflow to minimize solder bleed.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If single area of solder is used to couple components, then device complexity is reduced, but solder bleed control deteriorates
Solution Approach 1:
The clip is divided into multiple pillars (e.g., four pillars) instead of a single coupling structure. Each pillar has solder balls attached at its end, creating multiple discrete soldering areas. This segmentation allows each solder ball to be independently controlled during reflow, preventing uncontrolled solder bleed while maintaining relatively simple overall device structure.
Solution Approach 2:
The clip structure implements local quality by having solder balls positioned at specific locations at the ends of pillars. This localized solder application ensures that solder is confined to specific areas where electrical coupling is needed, preventing random solder bleed to adjacent components while maintaining good electrical contact where required.
2Manufacturing precision
If multiple pillars with solder balls are used, then solder bleed control is improved, but device complexity increases
Solution Approach 1:
The clip is divided into multiple pillars (e.g., four pillars) instead of a single coupling structure. Each pillar has solder balls attached at its end, creating multiple discrete soldering areas. This segmentation allows each solder ball to be independently controlled during reflow, preventing uncontrolled solder bleed while maintaining relatively simple overall device structure.
Solution Approach 2:
The solder balls are attached directly to the pillars in a configuration that allows them to self-align and self-constrain during the reflow process. The spherical shape of the solder balls and their positioning at the pillar ends enable automatic positioning and controlled melting, reducing the need for complex external control mechanisms while achieving predictable solder shapes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design reduces unpredictable solder bleed and maintains a small, predictable solder shape, preventing shorting between components and improving electrical coupling reliability.
Implementation Method 1
reflowing the solder balls to electrically couple the first electrically conductive component to the second electrically conductive component via the clip
Data Source
AI summary
A clip for a semiconductor package and a semiconductor having a clip is disclosed. In one example, the clip includes a first planar portion, a plurality of first pillars, and a plurality of first solder balls. Each first pillar of the plurality of first pillars is coupled to the first planar portion. Each first solder ball of the plurality of first solder balls is coupled to a corresponding first pillar of the plurality of first pillars.