Semiconductor Clip Package Layout for Independent Signal Paths
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Solution Overview
Problem
Conventional semiconductor packages face issues of excess cost, decreased reliability, and large package sizes, leading to suboptimal performance.
Innovation Solution
A semiconductor device design featuring a substrate with terminals, a semiconductor component with component terminals, and a clip structure that includes clips coupled to both the component and substrate terminals, with an encapsulant covering the components and clip structure, allowing for efficient coupling and protection while enabling independent electrical pathways through the removal of a sacrificial clip connector.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional semiconductor packages are used, then manufacturing is simpler, but cost increases and reliability decreases
Solution Approach 1:
The package structure is divided into distinct functional segments: the substrate provides mechanical support and external connections, the semiconductor component contains the active devices, and the encapsulant provides environmental protection. This segmentation allows each component to be optimized independently for its specific function, improving overall reliability without requiring complete redesign of the entire package.
Solution Approach 2:
The patent introduces intermediate elements such as the encapsulant that mediates between the semiconductor component and the external environment, and connection structures that mediate between the substrate and the component terminals. These intermediaries protect the sensitive semiconductor devices while enabling electrical connections, thereby improving reliability without directly complicating the core semiconductor structure.
2Volume of moving object
If conventional semiconductor packages are used, then manufacturing processes are traditional, but package size becomes too large
Solution Approach 1:
The patent merges multiple functions into integrated structures: the substrate serves both as mechanical support and electrical interconnection carrier, the encapsulant simultaneously provides environmental protection and structural support, and the connection structures integrate both mechanical attachment and electrical connection functions. This merging reduces the overall package volume by eliminating separate components and reducing spacing requirements.
3Reliability
If component terminals are directly connected to substrate terminals, then structure is simpler, but electrical pathways are not independent leading to decreased performance
Solution Approach 1:
The electrical connection path is segmented into distinct functional zones: component terminals, connection structures, and substrate terminals. This segmentation allows independent control of different electrical pathways, enabling separate source-drain and gate signal paths that prevent interference and improve device performance.
Solution Approach 2:
The connection structures serve as intermediary elements between the component terminals and substrate terminals, providing controlled electrical pathways. These intermediaries enable independent routing of different electrical signals (source-drain current and gate control signals) through separate paths, preventing signal interference while maintaining a structured connection architecture.
Data Source
AI summary
A method includes providing a substrate having substrate terminals and providing a first component having a first terminal and a second terminal. The method includes providing a clip structure having a first clip, a second clip, and a clip connector coupling the first clip to the second clip. The method includes coupling the first clip to the first terminal and a substrate terminal and coupling the second clip to another substrate terminal. The method includes encapsulating the structure and removing a portion of the clip connector. In some examples, the first portion of the clip connector includes a first portion surface, the second portion of the clip connector includes a second portion surface, and the first portion surface and the second portion surface are exposed from a top side of the encapsulant. Other examples and related structures are also disclosed herein.