Semiconductor Package Coating for Durable High-Contrast Ink Marking
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Solution Overview
Problem
Ink markings on semiconductor devices are prone to fading or disappearing due to organic solvents, physical wear, and other factors, affecting the visibility and readability of information codes such as bar codes.
Innovation Solution
A semiconductor device design that includes a resin layer with ink protected by a film, where the film has different surface roughness and reflectivity in regions with and without ink, enhancing visibility and readability of printed matters.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of information
If ink is printed on the shield film by inkjet printer, then information codes can be presented on the semiconductor device, but the ink may disappear or fade due to organic solvent, physical wearing, or other factors
Solution Approach 1:
The patent divides the protective structure into multiple functional layers: a lower protective layer (shield film) and an upper protective layer (clear coat layer). This segmentation allows each layer to perform specific functions - the shield film provides electromagnetic shielding and initial protection, while the clear coat layer specifically protects the ink from organic solvents and physical wear, ensuring long-term durability and readability of information codes.
Solution Approach 2:
The patent employs composite material structure by combining different materials with complementary properties: the shield film (first protective layer) and clear coat layer (second protective layer) are composed of different materials optimized for their respective functions. This composite approach enables simultaneous achievement of electromagnetic shielding, chemical resistance, and mechanical durability.
2Reliability
If a protective layer is added to protect the ink, then the ink durability is improved, but the device thickness increases
Solution Approach 1:
The patent utilizes thin film technology to create protective layers with minimal thickness. The clear coat layer and shield film are applied as thin coatings that provide comprehensive protection (chemical, mechanical, and electromagnetic) while maintaining the compact form factor of the semiconductor device. This approach ensures adequate protection without significantly increasing device thickness.
Solution Approach 2:
By combining multiple protective functions into a composite layer structure, the patent achieves comprehensive protection (chemical resistance, mechanical durability, electromagnetic shielding) in a compact multi-layer configuration rather than requiring thick single-layer protection, thus minimizing overall thickness increase.
3Reliability
If a multilayer film structure is used with varying materials, then adhesion, conductivity, and oxidation resistance are improved, but the manufacturing complexity increases
Solution Approach 1:
The patent segments the protective structure into distinct functional layers (shield film and clear coat layer) with clear interface definitions. This segmentation allows for standardized manufacturing processes where each layer can be applied and cured independently using established techniques, reducing overall manufacturing complexity despite the multi-layer structure.
Solution Approach 2:
The patent designs the multilayer structure where each layer serves multiple functions: the shield film provides both electromagnetic shielding and structural support, while the clear coat layer provides chemical resistance and mechanical protection. This multi-functionality reduces the need for additional specialized layers, simplifying the manufacturing process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design improves the visibility and reading ability of printed information by creating a significant brightness difference and regular vs. diffused reflection, protecting the ink from wear and chemical factors, and allowing for thinner semiconductor packages.
Implementation Method 1
An ink mark is printed on a shield film of the semiconductor package, for example, by an inkjet printer
Implementation Method 2
The ink is provided on an upper surface of the resin layer
Implementation Method 3
The surface roughnesses of the film are different between in a first region where the ink is provided and in a second region where the ink is not provided
Implementation Method 4
creating a high contrast between regions with and without ink
Implementation Method 5
A semiconductor device includes a resin layer, ink, and a film. The ink is provided on an upper surface of the resin layer. The film coats the resin layer and the ink
Implementation Method 6
using a multilayer film structure with varying materials for adhesion, conductivity, and oxidation resistance
Data Source
AI summary
A semiconductor device according to the present embodiment includes a resin layer, ink, and a film. The ink is provided on an upper surface of the resin layer. The film coats the resin layer and the ink. Surface roughnesses of the film are different between in a first region where the ink is provided and in a second region where the ink is not provided.