Semiconductor Construct Common Wiring Current Distribution
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Solution Overview
Problem
Conventional semiconductor devices with chip size packages face issues when the line width of wirings is reduced to 20 μm or less, leading to burning and breakage due to excessive current, as the relation between wirings and columnar electrodes becomes one-to-one, increasing the risk of electrical failure.
Innovation Solution
A semiconductor construct design featuring a common wiring connected to multiple connection pads, with separate columnar electrodes for power supply and ground voltage, and upper wirings connected to columnar electrodes through openings in an insulating film, allowing for distributed current handling and reduced resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the line width of wirings is reduced to 20 μm or less to increase the number of wirings and columnar electrodes, then the density of connections is improved, but the wirings are burned off and broken due to excessive current
Solution Approach 1:
The patent segments the wiring structure into multiple layers (first wiring layer, second wiring layer, third wiring layer) with different functions. The first wiring layer handles high-current power supply and ground connections with wider line widths, while the second and third wiring layers handle signal transmissions with narrower line widths. This segmentation allows narrow-line-density improvement without compromising the current-carrying capacity of power supply paths.
Solution Approach 2:
The patent transitions from a planar wiring layout to a three-dimensional multi-layer structure. By stacking wiring layers vertically and using via holes to connect them, the patent achieves higher connection density in the vertical dimension while maintaining adequate current capacity in the power supply paths through the first wiring layer.
2Ease of manufacture
If the relation between wirings and columnar electrodes is one-to-one, then the manufacturing process is simplified, but the current capacity is insufficient when excessive current runs through the wirings
Solution Approach 1:
The patent segments the electrical connection paths into dedicated power supply paths (through the first wiring layer) and signal transmission paths (through the second and third wiring layers). This segmentation allows the power supply columnar electrodes to be connected to multiple connection pads via the common first wiring layer, increasing current capacity without complicating the overall manufacturing process.
Solution Approach 2:
The first wiring layer serves as a universal power supply and ground distribution network that can connect to multiple connection pads simultaneously. This multi-functional wiring layer provides both power distribution and structural support, enabling increased current capacity while maintaining manufacturing simplicity through a standardized multi-layer process.
Data Source
AI summary
A semiconductor construct includes a semiconductor substrate and connection pads provided on the semiconductor substrate. Some of the connection pads are connected to a common wiring and at least one of the remaining of the connection pads are connected to a wiring. The construct also includes a first columnar electrode provided to be connected to the common wiring and a second columnar electrode provided to be connected to a connection pad portion of the wiring.