Semiconductor Chip Carrier Connection via Conductive Paste
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Solution Overview
Problem
Existing methods for manufacturing electronic systems with semiconductor chips face challenges in creating electrically, thermally, and mechanically stable connections between semiconductor chips and carriers while minimizing fabrication processes.
Innovation Solution
A method involving the application of a compound with electronically conductive particles to one main face of a semiconductor chip, using a mask with openings, and attaching the chip to a carrier, which includes conductive elements, with optional soldering of the second main face to a metal carrier, and sintering or electrical coupling to form a stable connection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional methods are used to connect semiconductor chips to carriers, then electrical connection can be achieved, but mechanical strength and thermal stability are insufficient
Solution Approach 1:
The patent employs a composite connection structure consisting of a solder layer and a conductive paste layer. The solder layer provides mechanical strength and thermal stability, while the conductive paste layer ensures electrical conductivity. This composite approach resolves the contradiction by combining materials with different properties to achieve both mechanical strength and electrical connection simultaneously.
Solution Approach 2:
The connection structure is designed to perform multiple functions: the solder joint provides mechanical bonding and thermal conduction, while the conductive paste provides electrical conduction. This multi-functional design allows a single connection structure to satisfy mechanical strength, thermal stability, and electrical connection requirements simultaneously.
2Reliability
If multiple fabrication processes are used to ensure connection quality, then connection reliability improves, but manufacturing complexity increases
Solution Approach 1:
The patent combines multiple functions into a single integrated connection structure that includes both solder joints and conductive paste in one layer system. This merging of mechanical bonding and electrical conduction functions into a unified structure reduces the number of separate fabrication processes needed while maintaining connection reliability.
Solution Approach 2:
The conductive paste is applied beforehand to the carrier before the semiconductor chip is mounted. This preliminary action ensures that the electrical connection path is already prepared, allowing the subsequent soldering process to focus primarily on mechanical bonding, thereby simplifying the overall fabrication process.
3Temperature
If thermal conduction is prioritized in the connection structure, then thermal management improves, but electrical conductivity may be compromised
Solution Approach 1:
The patent uses a composite connection structure where the solder layer serves as the primary thermal conduction path due to its high thermal conductivity, while the conductive paste layer ensures electrical conductivity. This composite material approach allows thermal management and electrical connection requirements to be satisfied simultaneously by assigning different materials to different functional roles.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method achieves a strong, stable, and efficient electrical and thermal connection between the semiconductor chip and the carrier, enhancing mechanical strength and reducing thermal mechanical stress while minimizing fabrication complexity.
Implementation Method 1
the compound including electronically conductive particles... forming an electrically and thermally conducting connection there between
Implementation Method 2
forming an electrically and thermally conducting connection there between
Implementation Method 3
with optional soldering of the second main face to a metal carrier
Implementation Method 4
and sintering or electrical coupling to form a stable connection
Data Source
AI summary
A method of manufacturing an electronic system. One embodiment provides a semiconductor chip having a first main face and a second main face opposite to the first main face. A mask is applied to the first main face of the semiconductor chip. A compound is applied to the first main face of the semiconductor chip. The compound includes electronically conductive particles. The semiconductor chip is coupled to a carrier with the compound facing the carrier.