Semiconductor Package Connection Pad Protection
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Solution Overview
Problem
Semiconductor connection pads are prone to corrosion and damage during the packaging process due to exposure to air, moisture, and chemical solutions, which affects the integrity and functionality of the chip.
Innovation Solution
A protective film with a narrower second opening is applied over the passivation film, covering the connection pad and minimizing exposure, thereby reducing corrosion and damage by acting as a barrier during the packaging process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the connection pad is exposed to allow electrical connection, then electrical connectivity is achieved, but corrosion and damage from air, moisture, and chemical solutions occur
Solution Approach 1:
The patent applies different properties to different parts of the connection pad structure. The connection pad has a conductive portion for electrical connection and a non-conductive protective coating on its upper surface that is selectively removable. This allows the lower surface to remain exposed for connectivity while the upper surface is protected during manufacturing, resolving the contradiction between exposure for connection and protection from harm.
Solution Approach 2:
The protective coating is applied to the connection pad before the semiconductor device undergoes packaging processes. This preliminary protective action prevents corrosion and damage from chemical solutions and moisture during manufacturing steps such as wire bonding and encapsulation, while allowing the pad to be exposed later when electrical connection is needed.
2Object-affected harmful factors
If the connection pad is covered to protect from corrosion, then protection from harmful substances is achieved, but electrical connection is blocked
Solution Approach 1:
The protective coating is applied selectively to specific regions of the connection pad - covering the upper surface while leaving the lower surface exposed. This local differentiation allows simultaneous achievement of protection (where coating is applied) and electrical connection (where coating is absent), resolving the contradiction between coverage for protection and exposure for connectivity.
3Reliability
If the protective coating is completely removed to allow electrical connection, then electrical connectivity is achieved, but exposure to harmful substances increases
Solution Approach 1:
Instead of completely removing the protective coating, the patent selectively removes it only from the portion of the connection pad that requires electrical connection. The remaining portions of the coating stay in place to continue providing protection against corrosion and damage, thus resolving the contradiction between full exposure for connection and partial protection from harm.
Solution Approach 2:
The patent applies partial removal of the protective coating rather than complete removal. This partial action is sufficient to achieve the necessary electrical connection while maintaining protection in areas where the coating remains, avoiding the excessive exposure that would occur with complete removal.
Data Source
AI summary
A semiconductor package includes a semiconductor chip, and including a passivation film disposed on an active surface and having a first opening exposing at least a portion of a connection pad of the semiconductor chip and a protective film disposed on the passivation film, filling at least a portion in the first opening, and having a second opening exposing at least a portion of the connection pad in the first opening, an encapsulant covering at least a portion of the semiconductor chip, and a connection structure disposed on the active surface of the semiconductor chip, and including a connection via connected to the connection pad in the first opening and the second opening and a redistribution layer electrically connected to the connection pad through the connection via. The second opening has a width narrower than a width of the first opening.