Semiconductor Contact Element Insulating Liner Structure
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Solution Overview
Problem
As semiconductor devices are scaled to smaller technology nodes, the decreasing separation between contact elements and semiconductor devices increases the risk of electrical shorts and leakage paths, making it challenging to ensure accurate contact formation without forming undesired contacts.
Innovation Solution
A contact element structure is developed with an insulating liner portion that covers the upper sidewall portion of an opening in an insulating material layer but not the lower sidewall portion, and a conductive material is positioned within the opening to cover the contact liner, reducing the risk of shorts between contact elements and semiconductor devices.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If contact elements are placed closer together to increase device density, then productivity and device integration are improved, but the risk of electrical shorts and leakage paths between contact elements increases
Solution Approach 1:
The contact element structure is segmented into multiple functional layers: an insulating material layer, an insulating liner portion, and a conductive material layer. This segmentation allows the insulating portion to act as a barrier between adjacent contact elements, enabling higher device density while preventing electrical shorts through the use of distinct functional zones within the contact structure
Solution Approach 2:
The insulating liner portion serves as an intermediary layer between the insulating material layer and the conductive material. This intermediary insulating layer prevents direct electrical contact between adjacent conductive contact elements while still allowing the contact structure to function, thus enabling higher density without increasing short-circuit risk
2Productivity
If the separation between contact elements and semiconductor devices is reduced to increase integration, then device density is improved, but manufacturing precision requirements increase due to alignment sensitivity
Solution Approach 1:
The insulating liner portion is formed in advance within the contact element structure, creating a pre-defined insulating barrier. This preliminary formation of the insulating layer ensures that even when contact elements are placed close to semiconductor devices, the pre-established insulating barrier maintains proper electrical isolation without requiring extremely tight alignment control during subsequent processing steps
3Length of moving object
If conventional contact structures are used at advanced technology nodes, then device scaling is achieved, but electrical shorts and leakage paths increase due to reduced separations
Solution Approach 1:
The contact element structure implements local quality by having different regions with different electrical properties: the insulating material layer and insulating liner portion provide electrical isolation in regions where shorts are problematic, while the conductive material layer provides electrical connection where needed. This localized differentiation of material properties allows advanced scaling while preventing harmful electrical shorts through targeted insulation at critical interfaces
Data Source
AI summary
A contact element structure of a semiconductor device includes an opening positioned in an insulating material layer, the insulating material layer being positioned above a semiconductor substrate, and the opening having an upper sidewall portion, a lower sidewall portion, and a bottom surface portion. An insulating liner portion is positioned within the opening, the insulating liner portion covering the insulating material layer at the upper sidewall portion but not covering the insulating material layer at the lower sidewall portion. A contact liner is positioned within the opening and covers the insulating liner portion, the insulating material layer at the lower sidewall portion, and the insulating material layer at the bottom surface portion, and a conductive material is positioned in the opening and covers the contact liner.