Semiconductor Module Layout for Direct Coolant Heat Dissipation
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Solution Overview
Problem
The existing semiconductor module in WO-2017/094370-A1 does not provide sufficient cooling for the semiconductor device due to the size of the cooling unit.
Innovation Solution
The semiconductor device includes a housing with a hollow space that accommodates coolant, allowing direct contact between the coolant and conductive members positioned between the semiconductor elements and the terminals, with protruding portions of the conductive members extending beyond protective layers to enhance cooling efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a conventional cooling unit with a heat sink is used, then the semiconductor device can be cooled, but the cooling efficiency is insufficient due to the size of the cooling unit
Solution Approach 1:
The conductive member is nested within the housing structure, with its second portion positioned in the hollow space where coolant flows. This integration allows the cooling function to be embedded within the existing device structure rather than adding a separate external cooling unit, thereby improving cooling efficiency while minimizing additional volume.
Solution Approach 2:
The conductive member extends in multiple directions: its first portion is between the semiconductor element and terminal in the first direction, while its second portion protrudes in a direction perpendicular to the first direction. This multi-dimensional configuration increases the heat transfer surface area and improves cooling efficiency without proportionally increasing the overall device volume.
2Temperature
If the conductive member is positioned between the semiconductor element and terminal, then electrical connection is achieved, but heat dissipation is insufficient without direct coolant contact
Solution Approach 1:
The conductive member acts as an intermediary between the semiconductor element and the coolant. Its first portion maintains electrical and thermal connection with the semiconductor element, while its second portion extends into the coolant flow path to facilitate direct heat transfer. This intermediary structure enables effective heat dissipation while maintaining the necessary electrical connections.
Solution Approach 2:
The conductive member performs multiple functions simultaneously: it provides electrical connection between the semiconductor element and terminal, serves as a thermal conduction path, and acts as a heat exchange surface with the coolant. This multi-functionality reduces the need for separate components and simplifies the overall device structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration achieves higher cooling efficiency by reducing energy loss and facilitating direct contact of coolant with the conductive members, thereby improving heat dissipation from the semiconductor elements.
Implementation Method 1
Coolant (such as cooling water) that flows through the hollow interior comes into contact with the heat sink. The heat sink thus efficiently cools the semiconductor device.
Implementation Method 2
Coolant (such as cooling water) that flows through the hollow interior comes into contact with the heat sink.
Data Source
AI summary
A semiconductor device includes: a first semiconductor element; a first terminal positioned on a first side in a first direction relative to the first semiconductor element; a protective layer of an insulator partially covering the first semiconductor element; and a first conductive member electrically connected to the first semiconductor element and the first terminal. The protective layer is spaced apart from the first terminal. The first conductive member is positioned between the first semiconductor element and the first terminal in the first direction. The first conductive member includes a first portion overlapping with the protective layer as viewed in a direction perpendicular to the first direction, and a second portion connected to the first portion and positioned on a side opposite the first semiconductor element with respect to the first portion. The second portion protrudes from the protective layer as viewed in a direction perpendicular to the first direction.