Semiconductor Cooling via Segmented Contact Array
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Solution Overview
Problem
Existing cooling methods for semiconductor devices face challenges such as high thermal resistance, stringent planarity requirements, and limited cooling capacity, making it difficult to operate at higher power levels and maintain effective temperature control.
Innovation Solution
A method and apparatus utilizing an array of contact elements thermally coupled to a cooling fluid, with a flexible, heat conductive sheet disposed between the contact elements and the semiconductor device to efficiently transfer heat, allowing for improved thermal contact and conductivity without requiring high planarity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a cooled diamond window is used to press on the backside of the semiconductor device, then heat transfer is improved, but thermal resistance remains high between the cold contact and the semiconductor device
Solution Approach 1:
The invention divides the cooling system into multiple contact elements arranged in an array rather than using a single large contact surface. This segmentation allows better adaptation to the semiconductor device surface and reduces thermal resistance by creating multiple thermal pathways from the device to the cooling fluid.
Solution Approach 2:
The contact elements are designed with specific local properties - they are thermally conductive materials that make direct contact with the semiconductor device surface. Each contact element provides localized high-quality thermal contact, and collectively they cover the heat-generating regions effectively.
2Adaptability or versatility
If a cooled diamond window is used with air-gap lens operation, then imaging analysis can be performed through the silicon substrate, but device planarity requirements are stringent
Solution Approach 1:
The invention introduces a flexible thermally conductive sheet that can conform to non-planar surfaces. This flexible sheet bridges the gap between the rigid contact elements and the semiconductor device surface, allowing the system to accommodate variations in surface flatness while maintaining effective thermal contact.
Solution Approach 2:
The contact elements are designed to be movable or adjustable, allowing them to adapt to the actual surface topology of the semiconductor device. This dynamic adjustment capability enables the system to maintain optimal thermal contact without requiring strict planarity control during manufacturing.
3Power
If existing cooling methods are used, then cooling is provided, but it is difficult to operate the device at higher power levels
Solution Approach 1:
The array of segmented contact elements creates multiple parallel thermal pathways from the semiconductor device to the cooling fluid. This segmentation increases the overall heat transfer capacity proportionally, enabling the system to handle higher power levels by distributing the heat load across multiple contact points.
Solution Approach 2:
The invention uses composite construction - a thermally conductive sheet made of high-conductivity material combined with contact elements and cooling fluid in a chamber. This composite approach creates a highly efficient thermal management system capable of handling increased power dissipation through synergistic material properties and design.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution reduces thermal resistance, enabling operation at higher power levels and cooling to temperatures below 0°C, while accommodating non-planar surfaces and eliminating the need for sealed optics in Solid Immersion Lens systems.
Implementation Method 1
disposing a flexible, heat conductive sheet between the respective end portions of the contact elements and the surface of the semiconductor device for transferring heat generated in the semiconductor device to the cooling fluid via the sheet and the contact elements
Implementation Method 2
contacting a surface of the semiconductor device with respective end portions of an array of contact elements thermally coupled to a cooling fluid
Implementation Method 3
transferring heat generated in the semiconductor device to the cooling fluid via the sheet and the contact elements
Data Source
AI summary
A method and an apparatus for cooling a semiconductor device. The method comprises the steps of contacting a surface of the semiconductor device with respective end portions of an array of contact elements thermally coupled to a cooling fluid, and disposing a flexible, heat conductive sheet between the respective end portions of the contact elements and the surface of the semiconductor device for transferring heat generated in the semiconductor device to the cooling fluid via the sheet and the contact elements.