Semiconductor Cooling Apparatus With Flexible Manifolds
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Solution Overview
Problem
Existing semiconductor cooling apparatuses face challenges in accommodating vertical height variations and planarity variations of semiconductor assemblies, leading to inefficiencies in heat transfer and increased costs due to the need for custom heat spreaders and rigid interconnects, which are not effective for high-power or size-constrained applications.
Innovation Solution
A semiconductor cooling apparatus featuring a monolithic planar heat exchanger with flexible coolant supply and return manifolds that can conform to the height of semiconductor elements, reducing thermal resistance and maintaining thermal coupling through spring-loaded deformation, thereby integrating structural and hydraulic functions within a single component.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If rigid fluidic interconnects and springs are used to accommodate vertical height variations, then thermal coupling is maintained, but size and weight increase
Solution Approach 1:
The patent uses flexible bellows made from thin-walled tubing instead of rigid fluidic interconnects and springs. The bellows can expand and contract to accommodate vertical height variations while maintaining thermal coupling, eliminating the need for heavy springs and rigid components. This directly resolves the contradiction by providing flexibility without increasing weight.
Solution Approach 2:
The flexible bellows serve multiple functions simultaneously: they act as fluidic interconnects for coolant flow, provide mechanical flexibility to accommodate height variations, and function as thermal conduction paths. This multi-functionality eliminates the need for separate springs and rigid interconnects, reducing overall weight while maintaining thermal coupling.
2Reliability
If custom heat spreaders and rigid interconnects are used, then thermal coupling is maintained, but manufacturing cost increases
Solution Approach 1:
The flexible bellows integrate multiple functions (fluidic interconnection, mechanical flexibility, thermal conduction) into a single component, eliminating the need for custom heat spreaders and multiple rigid interconnects. This standardization reduces manufacturing complexity and cost while maintaining effective thermal coupling.
Solution Approach 2:
The patent merges the functions of heat spreaders, rigid interconnects, and flexible mounting mechanisms into a single flexible bellows component. This consolidation simplifies the manufacturing process and reduces the number of parts that need to be assembled, thereby reducing manufacturing costs while maintaining thermal coupling effectiveness.
3Ease of operation
If flexible bellows with circular cross-section are used, then flexibility is achieved, but pressure loss increases
Solution Approach 1:
The patent transitions from circular cross-section bellows to elliptical cross-section bellows. The elliptical shape provides comparable flexibility for accommodating height variations while offering a more hydrodynamic flow path that reduces turbulence and pressure loss. The curved geometry of the ellipse optimizes coolant flow compared to the circular section.
Solution Approach 2:
The invention changes the geometric parameter of the bellows cross-section from circular to elliptical. This parameter change maintains the flexibility needed for height variation accommodation while significantly reducing coolant velocity and pressure loss, directly addressing the energy loss issue.
4Device complexity
If bellows are positioned at single location, then simplicity is maintained, but coolant distribution to multiple fins is uneven
Solution Approach 1:
The patent divides the cooling system into multiple sections with separate bellows positioned at both ends of fin rows. This segmentation allows each bellows to independently supply coolant to specific fin sections, ensuring uniform coolant distribution across all fins. The segmentation approach maintains relative simplicity while achieving precise flow distribution.
Solution Approach 2:
The invention implements local quality by positioning bellows at specific locations (both ends of fin rows) to optimize coolant distribution to different fin sections. Each location receives tailored attention with dedicated bellows, ensuring that coolant flow is evenly distributed throughout the entire cooling apparatus.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The flexible design enhances heat transfer efficiency, reduces installation time and costs, and allows for effective cooling in applications with height and size constraints, extending the life of semiconductor elements while minimizing the need for customizations and bulky interconnects.
Implementation Method 1
the flexible coolant supply manifold and flexible coolant return manifold are configured to flex to conform to a height of the semiconductor element and to apply a spring force to maintain the thermal coupling
Implementation Method 2
a planar heat exchanger configured to thermally couple to the semiconductor element to transfer heat from the semiconductor element to coolant flowing through the planar heat exchanger
Implementation Method 3
transfer heat from the semiconductor element to coolant flowing through the planar heat exchanger
Data Source
Figure 1
Figure 2~3
Figure 4~5
AI summary
In some embodiments, a semiconductor cooling apparatus includes a heat exchanger configured to thermally couple to a semiconductor element to transfer heat to coolant flowing through the heat exchanger. The apparatus also includes a flexible coolant supply manifold and a flexible coolant return manifold. The flexible coolant supply manifold and flexible coolant return manifold flex to conform to a height of the semiconductor element to apply a force to maintain the thermal coupling between the heat exchanger and the semiconductor element. The apparatus also includes a cold plate located under the semiconductor element, the cold plate configured to couple to the flexible coolant supply manifold via a first riser to provide coolant to the flexible coolant supply manifold and configured to couple to the flexible coolant return manifold via a second riser to exhaust returned coolant to the cold plate.