Semiconductor Cooling Plate Warping Prevention
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Solution Overview
Problem
Conventional semiconductor devices with double-side cooling structures experience reduced cooling performance due to warping of cooling plates caused by the contraction of joining materials, leading to a loss of parallelism between the upper and lower cooling plates.
Innovation Solution
A semiconductor device design featuring a case with an up-and-down width greater than the remaining portions, specifically around the semiconductor-chip mounting parts, to prevent warping of cooling plates during joining material contraction, maintaining optimal parallelism and enhancing rigidity, thus preventing a reduction in cooling performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a joining material is used to join the semiconductor chip to the cooling plates, then the semiconductor chip can be securely mounted, but the contraction of the joining material causes warping of the cooling plates and loss of parallelism
Solution Approach 1:
The case is designed with a restricted portion that proactively counteracts the warping force before it can significantly affect the cooling plates. This preliminary structural constraint prevents the harmful effect of joining material contraction, maintaining parallelism while still allowing secure mounting.
Solution Approach 2:
The restricted portion of the case acts as an intermediary structural element between the cooling plates and the joining material. It absorbs and distributes the contraction forces, preventing direct transmission of warping forces to the cooling plates while maintaining the mounting function.
2Shape
If the case structure is made rigid to prevent warping, then parallelism is maintained, but the overall device size increases
Solution Approach 1:
Instead of making the entire case uniformly rigid, only a specific restricted portion is designed with increased up-and-down width to provide local reinforcement. This localized structural enhancement maintains parallelism where needed while minimizing the overall footprint of the case.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design effectively prevents warping of cooling plates, maintains optimal parallelism, and enhances the semiconductor device's cooling performance, reliability, and miniaturization, while reducing the need for additional processing and improving yield.
Implementation Method 1
a joining material contracts when the semiconductor chip is joined to the thin metal plate
Data Source
AI summary
Provided is a technique for preventing warps of cooling plates due to a contraction of a joining material, thereby preventing a reduction in cooling performance of a semiconductor device. The semiconductor device includes the following: a first cooling plate; a second cooling plate facing the first cooling plate; a semiconductor chip joined between the circuit pattern of the first cooling plate and the circuit pattern of the second cooling plate with a joining material; and a case containing part of the first cooling plate, part of the second cooling plate, and the semiconductor chip. The semiconductor chip is mounted in a semiconductor-chip mounting part between the first cooling plate and the second cooling plate. The case is provided with a portion corresponding to the semiconductor-chip mounting part and to surroundings thereof. The portion has an up-and-down width greater than an up-and-down width of the remaining portions of the case.