Semiconductor Module Screw-Mounted Cooling Interface Without Solder
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Solution Overview
Problem
Existing methods for connecting a semiconductor device's conductor layer to a cooling member using bonding materials like sintered material or solder can cause remelting, damage, or separation of components, leading to quality deterioration.
Innovation Solution
A semiconductor device design featuring a conductor layer with a first through hole, an insulating plate with a larger second through hole, and a circuit pattern layer with an even larger opening, connected via a screw member and heat transfer medium without applying heat or pressure, preventing damage and separation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If bonding materials like sintered material or solder are used to connect the conductor layer to the cooling member, then strong connection is achieved, but remelting, damage, or separation of components occurs leading to quality deterioration
Solution Approach 1:
The invention extracts and eliminates the bonding materials (sintered material or solder) from the connection structure. By removing these materials that cause remelting and damage during reflow processing, the patent achieves reliable component quality while maintaining connection strength through direct mechanical contact between the conductor layer and cooling member.
2Ease of manufacture
If through-holes are formed in the conductor layer and insulating plate for screw insertion, then attachment to cooling member is enabled, but structural complexity increases
Solution Approach 1:
The invention segments the through-hole formation into distinct layers: a first through-hole in the conductor layer and a second through-hole in the insulating plate. This segmentation allows each layer to be processed independently with appropriate hole sizes, enabling screw attachment while managing structural complexity through organized layer-wise design.
3Ease of operation
If the insulating plate has a larger opening than the conductor layer through-hole, then screw insertion is facilitated, but precision alignment becomes more difficult
Solution Approach 1:
The insulating plate acts as an intermediary element between the conductor layer and the screw. By providing a second through-hole with a larger opening than the first through-hole in the conductor layer, the insulating plate facilitates easy screw insertion while the layered structure maintains alignment precision through the positioned relationship between the two holes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Prevents quality deterioration by avoiding remelting and damage to components, ensuring strong and reliable connections without the need for bonding materials, while improving heat dissipation and electrical integrity.
Implementation Method 1
a heat transfer medium disposed between the conductor layer and the cooling member
Data Source
AI summary
A semiconductor module includes a conductor layer, an insulating plate, a circuit pattern layer, and semiconductor chips disposed in this order. The conductor layer has a first through hole. The insulating plate has a second through hole having an opening size larger than the first through hole at a location facing the first through hole. The circuit pattern layer has an opening having an opening size larger than the second through hole at a location facing the second through hole. When the semiconductor module is connected to a cooling member, heat transfer medium is disposed between the conductor layer and the cooling member. A screw member is inserted into the opening and second and first through holes and screwed into a screw attachment hole. The screw member presses an area around the first through hole inside the second through hole toward the cooling member.