Semiconductor Module Cooling Layout for Solder Stress Relief
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Solution Overview
Problem
Conventional semiconductor modules with cooling fins face challenges in uniform cooling of semiconductor chips due to stress and plastic strain issues in the solder interposed between metal layers and the cooling apparatus, leading to reduced heat cycle reliability and efficiency.
Innovation Solution
The semiconductor module incorporates a cooling apparatus with a configuration where the main coolant flow direction is orthogonal to the chip arrangement, featuring reinforcement pins connecting the top and bottom plates to manage thermal expansion and reduce stress on the solder, along with a design that integrates the top plate, side wall, and fins to enhance heat transfer and mechanical integrity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If cooling fins are added to improve cooling efficiency, then heat dissipation performance is improved, but stress and plastic strain in solder increase leading to reduced heat cycle reliability
Solution Approach 1:
The patent changes the orientation parameter of cooling fins from the conventional direction parallel to chip arrangement to an orthogonal direction perpendicular to chip arrangement. This parameter change modifies the thermal field distribution and stress patterns, allowing effective cooling while reducing solder stress and plastic strain during thermal cycles.
Solution Approach 2:
The patent introduces asymmetric positioning of cooling fins relative to the semiconductor chips. By orienting fins orthogonally rather than symmetrically parallel to chip arrangement, the thermal conduction paths and stress distribution become asymmetric, which prevents uniform stress concentration on solder joints and improves heat cycle reliability.
2Reliability
If reinforcement pins are added to reduce solder stress, then heat cycle reliability is improved, but device complexity increases
Solution Approach 1:
The reinforcement pins serve multiple functions simultaneously: they provide mechanical reinforcement to reduce solder stress, act as thermal conduction paths to improve heat dissipation, and serve as structural support elements. This multi-functionality allows reliability improvement without proportionally increasing device complexity.
Solution Approach 2:
The patent merges the reinforcement function with the thermal management function by integrating reinforcement pins into the existing cooling structure. The pins are positioned to both mechanically support the assembly and conduct heat from the semiconductor chips, combining two separate functions into a single integrated element.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively prevents large stresses and plastic strains in the solder, improving the heat cycle reliability and cooling efficiency while maintaining the structural integrity of the semiconductor module.
Implementation Method 1
a cooler including cooling fins is implemented
Implementation Method 2
a cooling apparatus with a configuration where the main coolant flow direction is orthogonal to the chip arrangement
Data Source
AI summary
Provided is a semiconductor module including a semiconductor device and a cooling apparatus, wherein the semiconductor device includes semiconductor chips, circuit boards where the semiconductor chips are implemented, and a resin structure for sealing the semiconductor chips; the cooling apparatus includes a top plate, a side wall, a bottom plate, a coolant flow portion, a plurality of fins and reinforcement pins; the metal layer has a part overlapped with the cooling region, and other parts other than the part overlapped with one communication region of the first communication region and the second communication region in planar view; and the reinforcement pins are arranged in the one communication region.