Semiconductor Die Corner Lids for Thermal Expansion Restraint
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Solution Overview
Problem
The semiconductor industry faces challenges in further reducing the physical size of semiconductor devices while maintaining structural integrity and efficiency, particularly in stacked and bonded semiconductor devices where sophisticated bonding processes are used.
Innovation Solution
The implementation of corner lids made from materials with a lower coefficient of thermal expansion, such as copper or stainless steel, to reinforce the corners of semiconductor dies, combined with a ring for additional support, helps constrain thermal expansion and reduce stress during manufacturing and operation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of moving object
If stacked and bonded semiconductor devices are used to reduce physical size, then integration density is improved, but structural integrity and reliability deteriorate due to thermal expansion stress
Solution Approach 1:
The patent applies different materials with specific properties to different locations on the semiconductor die. Corner lids made of materials with low coefficient of thermal expansion (CTE) are placed specifically at the corners where stress concentration occurs during bonding processes. This local application of specialized materials addresses the thermal expansion issue at critical stress points without requiring the entire device to be redesigned.
Solution Approach 2:
The patent employs composite material structures combining semiconductor die with corner lids made of materials having different CTE properties. The corner lids act as composite elements that compensate for the thermal expansion of the semiconductor die during bonding, creating a more reliable stacked device structure that maintains integrity under thermal stress.
2Reliability
If corner lids with lower coefficient of thermal expansion are used, then structural integrity is improved, but device complexity increases
Solution Approach 1:
Rather than modifying the entire semiconductor die or using a single complex material throughout, the patent segments the solution by applying corner lids only at the four corner regions where stress concentration occurs during bonding. This segmentation approach maintains simplicity in the majority of the device while providing targeted reinforcement only where needed.
Solution Approach 2:
The corner lids serve as intermediary elements between the semiconductor die and the external environment during bonding processes. These lids act as mediators that absorb and distribute thermal expansion stresses, protecting the bonded interfaces without requiring complex modifications to the bonding process itself or the semiconductor die structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the structural integrity and reduces defects in semiconductor devices by restraining thermal expansion, thereby improving manufacturing yields and device performance.
Implementation Method 1
corner lids made from materials with a lower coefficient of thermal expansion, such as copper or stainless steel, to reinforce the corners of semiconductor dies, combined with a ring for additional support, helps constrain thermal expansion and reduce stress during manufacturing and operation
Data Source
AI summary
Semiconductor devices and methods of manufacture which utilize lids in order to constrain thermal expansion during annealing are presented. In some embodiments lids are placed and attached on encapsulant and, in some embodiments, over first semiconductor dies. As such, when heat is applied, and the encapsulant attempts to expand, the lid will work to constrain the expansion, reducing the amount of stress that would otherwise accumulate within the encapsulant.