Semiconductor Module Cover Structure for Flare and Ghost Suppression
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Solution Overview
Problem
In semiconductor modules with chip-on-chip or chip-on-wafer structures, flare and ghost issues arise due to light reflection from functional components like logic chips, which existing shielding techniques fail to adequately address.
Innovation Solution
A semiconductor module design featuring a cover part, such as a frame, that covers the logic chips and wiring from the upper surface, excluding the pixel region, to prevent light reflection, with options including a hollow structure, embossed inner walls, and sealing resins to minimize reflection and allow incident light on the pixel region.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If light shielding structures are added to prevent reflection from functional components, then flare and ghost are reduced, but device complexity increases
Solution Approach 1:
The patent merges multiple light shielding functions into integrated structures. For example, the protective substrate is combined with light shielding films or three-dimensional light shielding structures that serve dual purposes: protecting the sensor while simultaneously blocking reflected light from functional components. This merging reduces the number of separate components and simplifies the overall device structure while maintaining effective light shielding.
Solution Approach 2:
The patent designs light shielding structures that perform multiple functions. The protective substrate not only protects the sensor but also serves as a mounting platform for light shielding films. The light shielding structures are designed to simultaneously block reflected light from functional components and prevent direct light exposure to non-pixel regions, making them multi-functional elements that reduce overall device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Effectively prevents light ray reflection from logic chips while allowing light to enter the pixel region, enhancing image quality and reducing module size and height.
Implementation Method 1
in a case where a chip-on-chip structure or a chip-on-wafer structure is employed, a functional component such as a logic chip is arranged around a pixel region, in which light rays are reflected from the functional component, and flare or ghost may occur
Data Source
AI summary
To prevent unnecessary light ray reflection in a semiconductor module employing a chip-on-chip structure or a chip-on-wafer structure. The semiconductor module includes a substrate, first and second semiconductor elements, and a cover part. The first semiconductor element is arranged on the substrate. The first semiconductor element includes a wiring electrically connected to the substrate and a pixel region of an imaging element on an upper surface opposite to a surface facing the substrate. The second semiconductor element is arranged at a position different from the pixel region on the upper surface of the first semiconductor element. The cover part covers the first and second semiconductor elements from the upper surface with respect to at least a part of a region excluding the pixel region.