Semiconductor Temperature Control via Current Splitting
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Solution Overview
Problem
Existing semiconductor component arrangements face high thermal loads, which shorten their service life, particularly in semiconductor light sources like LEDs, due to inefficient temperature control and the need for complex circuitry to regulate supply currents based on temperature.
Innovation Solution
An arrangement that includes a thermoelectric component, a control unit, and a temperature sensor to dynamically adjust the supply current to the semiconductor component, allowing for temperature-dependent energy distribution between the semiconductor and thermoelectric components, reducing waste heat production and eliminating the need for external temperature monitoring and complex current regulation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If active temperature control is implemented using a thermoelectric component, then temperature control capability is improved, but high thermal stresses occur during semiconductor device operation
Solution Approach 1:
The supply current connection serves dual purposes: it powers both the semiconductor device and the thermoelectric component. The system uses its own operating current to drive temperature control, eliminating the need for separate control circuitry and reducing additional thermal loads on the semiconductor device.
Solution Approach 2:
The control unit dynamically adjusts the supply current distribution based on real-time temperature feedback from the temperature sensor. The portion of current directed to the thermoelectric component varies continuously with temperature conditions, optimizing cooling efficiency while minimizing thermal stress on the semiconductor device.
2Loss of energy
If throttling is used to reduce power losses and waste heat production, then heat generation is reduced, but additional circuitry is required for temperature monitoring and current control
Solution Approach 1:
The supply current connection is merged to serve both the semiconductor device and the thermoelectric component simultaneously. The control unit integrates temperature monitoring and current regulation functions, while the temperature sensor provides feedback directly to the control unit, eliminating the need for separate monitoring and control circuitries.
Solution Approach 2:
The supply current connection performs multiple functions: it powers the semiconductor device, powers the thermoelectric component for temperature control, and enables temperature-dependent current regulation. This multi-functionality reduces the need for additional dedicated circuitry for each function.
3Temperature
If external power supply with temperature monitoring is used, then temperature control is achieved, but current regulators and additional devices are required in the external power supply
Solution Approach 1:
The temperature control function is extracted from the external power supply and integrated directly at the semiconductor device level. The control unit and temperature sensor are positioned to work directly with the semiconductor device and thermoelectric component, removing the need for complex temperature monitoring and current regulation circuitry in the external power supply.
Solution Approach 2:
The control unit acts as an intermediary between the supply current connection and both the semiconductor device and thermoelectric component. It receives temperature feedback from the sensor and dynamically adjusts current distribution, simplifying the external power supply requirements while maintaining precise temperature control capability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution provides efficient and simple temperature control, extending the service life of semiconductor components by reducing thermal loads and enhancing the cooling capacity of thermoelectric components, particularly in high-power LED applications.
Implementation Method 1
a thermoelectric component (14), in particular a Peltier element, which is configured to temperature-control, in particular to cool and/or heat, the semiconductor device (12)
Data Source
Figure 1~3
AI summary
The invention relates to an arrangement (18) for operating at least one semiconductor device, comprising at least one semiconductor device to be operated and at least one thermoelectric component (14), wherein the thermoelectric component (14) is configured to temperature control the semiconductor device, in particular to cool and/or heat it, wherein the arrangement (18) has at least one supply current connection (26, 28) for supplying the semiconductor device with a supply current (Iv).It is characterized in that the arrangement (18) comprises a control unit (20) and a temperature sensor (22) connected to the control unit (20), which is configured to detect a temperature (T) of the semiconductor device, and wherein the control unit (20) is configured to direct a temperature-dependent fraction (p%) of the supply current (Iv) fed into the arrangement (18) at the supply current connection (26, 28) past the semiconductor device and feed it into the thermoelectric component (14). Furthermore, a lamp (10), in particular a vehicle lamp, and a method for operating at least one semiconductor device are presented.