Semiconductor Device Cushioning Adhesion Prevention
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
In semiconductor device manufacturing, the use of sinterable metal bonding technology faces issues with the adhesion of cushioning materials to the semiconductor element during thermal press bonding, leading to potential malfunctions and low product yield due to shear force-induced fragmentation and contamination.
Innovation Solution
The semiconductor device employs base plate electrodes with protrusions or depressions, or the use of a jig with an acute angled top, to disperse and reduce shear forces acting on the cushioning, preventing adhesion to the semiconductor element's surface during thermal press bonding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a cushioning is used to protect the semiconductor element surface during thermal press bonding, then the element surface is protected from direct pressing damage, but the cushioning material adheres to the element surface due to shear force-induced fragmentation
Solution Approach 1:
A release paper is introduced as an intermediary layer between the cushioning and the semiconductor element surface. This release paper prevents direct adhesion between the cushioning material and the element surface while still allowing the cushioning to provide protective cushioning during thermal press bonding. The release paper acts as a mediator that eliminates the harmful adhesion effect while preserving the beneficial protection function.
Solution Approach 2:
The cushioning structure is segmented into multiple functional layers: the original cushioning material layer and an additional release paper layer. This segmentation allows the system to simultaneously achieve surface protection (through the cushioning layer) and prevent adhesion (through the release paper layer), resolving the contradiction between these two opposing requirements.
2Strength
If excess pressure is applied during thermal press bonding to ensure sufficient sintering, then bonding strength is improved, but the cushioning material is torn into fibrous pieces by shear force
Solution Approach 1:
The release paper serves as a mediator that absorbs and distributes the shear forces generated during high-pressure bonding. By placing the release paper between the cushioning and the semiconductor element, the shear force that would otherwise tear the cushioning into fibrous pieces is redirected and distributed, allowing excess pressure to be applied for strong bonding without causing cushioning fragmentation.
Solution Approach 2:
The release paper is placed beforehand as a protective layer that cushions against the harmful effects of shear force during pressing. This prior cushioning prevents the cushioning material from being torn while still allowing the necessary bonding pressure to be applied, thus resolving the contradiction between bonding strength and cushioning integrity.
3Adaptability or versatility
If the cushioning is made from fluorine resin like PTFE to achieve high resilience and thermal resistance, then bonding process performance is improved, but the resin is torn off into fibrous pieces under excess pressure
Solution Approach 1:
The release paper acts as an intermediary layer that prevents direct contact between the fluorine resin cushioning and the semiconductor element surface. This allows the use of PTFE or similar fluorine resins that provide high resilience and thermal resistance for optimal bonding process performance, while the release paper prevents these materials from being torn into fibrous pieces and adhering to the element surface under excess pressure.
Solution Approach 2:
Instead of directly using the fluorine resin cushioning in contact with the semiconductor element, a release paper copy or substitute layer is introduced. This release paper layer replicates the cushioning function of preventing direct pressing damage while having the added benefit of preventing fibrous adhesion, thus allowing the use of high-performance fluorine resin cushioning without its harmful adhesion side effect.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively prevents the adhesion of cushioning materials to the semiconductor element, enhancing bonding reliability and reducing the risk of malfunctions and contamination, thereby improving product yield and quality.
Implementation Method 1
a sinterable metal bonding material, which performs bonding by means of a sintering phenomenon of metal particles
Data Source
AI summary
When a semiconductor element is bonded to a base plate electrode, a cushioning is used for protecting the surface of the semiconductor element. A protrusion having an outwardly cutting shape is formed around an area on the base plate electrode for bonding the semiconductor element to disperse and reduce shear force acting on the cushioning during the bonding, so that no cushioning adheres to the surface of the semiconductor element after bonding.