Semiconductor Device Partially Opened Annular Die-Bonding Material
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Solution Overview
Problem
The heat dissipation performance of semiconductor devices is compromised due to the arrangement of die-bonding materials, leading to thermal shading and reduced image quality in high-density regions of semiconductor chips.
Innovation Solution
A semiconductor device design featuring a die-bonding material formed in a partially opened annular shape, strategically positioned between high-density regions of the semiconductor chip and the substrate, facilitates efficient heat absorption and dissipation, utilizing a temperature gradient to release heat from high-density areas to the outside through an open portion, thereby preventing thermal shading.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If die-bonding material is arranged in a conventional manner, then the semiconductor chip can be mounted on the substrate, but the heat dissipation performance is lowered due to heat accumulation in high-density regions
Solution Approach 1:
The die-bonding material is segmented into a partially opened annular shape with multiple discrete regions rather than a continuous layer. This segmentation creates heat dissipation pathways while maintaining mechanical bonding, allowing heat to escape from high-density regions without requiring a completely complex reconfiguration of the bonding structure.
Solution Approach 2:
The die-bonding material is strategically positioned to provide different functions in different regions: in high-density regions, the partial openings enable heat dissipation, while in other areas, the material maintains strong bonding. This local differentiation optimizes both thermal management and mechanical attachment without excessive complexity.
2Object-affected harmful factors
If die-bonding material is provided in high-density regions, then the semiconductor chip is securely mounted, but thermal shading occurs and image quality deteriorates
Solution Approach 1:
The die-bonding material is extracted from continuous coverage and reconfigured as a partially opened annular shape. This removal of material from certain high-density regions eliminates the thermal shading effect that would otherwise occur, while the remaining portions maintain sufficient mounting security through strategic positioning around the periphery.
Solution Approach 2:
The die-bonding material, which normally causes thermal shading when continuously applied, is reconfigured into a partially opened annular shape that converts this harmful thermal blocking effect into a beneficial heat dissipation pathway. The openings allow heat to escape while the material itself remains in positions that maintain bonding security.
3Temperature
If die-bonding material is arranged to improve heat dissipation, then thermal management improves, but the mounting strength may be compromised
Solution Approach 1:
The die-bonding material arrangement dynamically balances two opposing requirements: the partial openings provide heat dissipation pathways while the remaining annular portions maintain bonding strength. The configuration is optimized so that heat dissipation and mounting security are simultaneously achieved through the spatial distribution of the material.
Solution Approach 2:
The partially opened annular die-bonding material structure serves multiple functions simultaneously: it provides mechanical bonding between the chip and substrate, enables heat dissipation from high-density regions, and maintains structural integrity. This multi-functionality resolves the contradiction between heat dissipation and mounting strength.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances heat dissipation performance by effectively dissipating heat generated from high-density regions, suppressing thermal shading and maintaining image quality by creating a temperature gradient that directs heat away from sensitive areas, thus improving overall thermal management.
Implementation Method 1
a die-bonding material which is provided between the region in which the integration density is high in the semiconductor chip and the substrate and which is formed in a partially opened annular shape in a plan view
Implementation Method 2
facilitates efficient heat absorption and dissipation, utilizing a temperature gradient to release heat from high-density areas to the outside through an open portion
Implementation Method 3
utilizing a temperature gradient to release heat from high-density areas to the outside through an open portion, thereby preventing thermal shading
Data Source
AI summary
A semiconductor device (1) according to the present disclosure includes a semiconductor chip (2), an interposer substrate (3), and a die-bonding material (4) formed in a partially opened annular shape in a plan view. The semiconductor chip (2) includes a region in which an integration density of an electronic circuit is high (23, 24, and 25) and a region in which the integration density is low (22). The semiconductor chip (2) is implemented on the interposer substrate (3). The die-bonding material (4) formed in a partially opened annular shape in a plan view is provided between the region in which the integration density is high (23, 24, and 25) in the semiconductor chip (2) and the interposer substrate (3).