Semiconductor Device High-Temperature Stability

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Solution Overview

Problem

Transistors using oxide semiconductors exhibit higher off-state current and are more likely to have normally-on characteristics as temperature increases, leading to reduced reliability and fluctuations in electrical characteristics.

Innovation Solution

A semiconductor device with a metal oxide structure, including specific regions with controlled carrier concentrations and hydrogen concentration, is designed to stabilize operation at high temperatures, reduce off-state current, and enhance reliability by using a metal oxide with indium, aluminum, gallium, yttrium, or tin, and zinc, and incorporating tantalum nitride layers to manage carrier concentrations and hydrogen levels.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a transistor using an oxide semiconductor is used, then the off-state current is extremely low at room temperature, but the off-state current increases and normally-on characteristics occur at high temperatures

Engineering Contradiction:
Improvetransistor operation stabilityVSAvoidoff-state current at high temperature
Core Design Contradiction:
ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The patent applies local quality by creating distinct regions within the oxide semiconductor layer with different carrier concentrations. The first region (channel formation region) has a carrier concentration of 1×10^12 to 1×10^17 cm^-3, while the second region has a carrier concentration of 1×10^17 to 1×10^19 cm^-3. This spatial differentiation allows the channel region to maintain low off-state current at high temperatures while the other region provides necessary electrical characteristics.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The patent changes the carrier concentration parameter within the oxide semiconductor layer to resolve the temperature-dependent reliability issue. By controlling the carrier concentration to be 1×10^12 to 1×10^17 cm^-3 in the channel formation region, the transistor maintains stable electrical characteristics and low off-state current even at high temperatures, preventing normally-on characteristics.

Inventive Principle:
Principle #35Parameter changes

2Power

If the carrier concentration in the oxide semiconductor is increased to improve conductivity, then the on-state current increases, but the off-state current also increases and normally-on characteristics occur

Engineering Contradiction:
Improveon-state currentVSAvoidthreshold voltage stability
Core Design Contradiction:
PowerVSReliability

Solution Approach 1:

The patent applies local quality by creating distinct regions within the oxide semiconductor layer with different carrier concentrations. The first region (channel formation region) has a carrier concentration of 1×10^12 to 1×10^17 cm^-3, while the second region has a carrier concentration of 1×10^17 to 1×10^19 cm^-3. This spatial differentiation allows the channel region to maintain low off-state current at high temperatures while the other region provides necessary electrical characteristics.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The patent changes the carrier concentration parameter within the oxide semiconductor layer to resolve the temperature-dependent reliability issue. By controlling the carrier concentration to be 1×10^12 to 1×10^17 cm^-3 in the channel formation region, the transistor maintains stable electrical characteristics and low off-state current even at high temperatures, preventing normally-on characteristics.

Inventive Principle:
Principle #35Parameter changes

Data Source

PatentUS20210226063A1Semiconductor device and method for manufacturing semiconductor device
Publication Date: 2021.07.22 SEMICON ENERGY LAB CO LTD
  • US20210226063A1 patent drawing
  • US20210226063A1 patent drawing
  • US20210226063A1 patent drawing

AI summary

A semiconductor device that stably operates even at high temperature is provided. The semiconductor device includes a metal oxide, an insulating layer, a first conductive layer, a second conductive layer, and a third conductive layer. The metal oxide includes a first region, a second region, and a third region. The first region overlaps with the first conductive layer. The second region overlaps with the second conductive layer. The third region overlaps with the third conductive layer with the insulating layer interposed therebetween. The value of the ratio of the carrier concentration in the first region to the carrier concentration in the third region is 100 or more. The value of the ratio of the carrier concentration in the second region to the carrier concentration in the third region is 100 or more.