Semiconductor Device Thinner Sealing Resin via Substrate Conductive Portions
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Solution Overview
Problem
Conventional semiconductor devices in leadless packages face challenges in reducing the thickness of the sealing resin due to the presence of wires on the semiconductor element and limitations in the thinness of the lead frame, which restricts the overall device thickness.
Innovation Solution
A semiconductor device configuration with a first substrate, first and second conductive portions of the electrode, and a sealing resin, where the second electrode is exposed and electrically connected to the first electrode, allowing for a thinner design by eliminating the need for a lead frame and enabling the use of electroless plating for the second electrodes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If a conventional lead frame structure with wires is used, then electrical connections are established, but the thickness of the sealing resin cannot be reduced due to wire placement requirements
Solution Approach 1:
The patent extracts and eliminates the wire interconnection structure from the conventional lead frame design. Instead of using wires to connect the semiconductor element to the lead frame, the invention directly integrates conductive portions into the substrate, removing the unnecessary wire components and enabling thinner sealing resin design.
Solution Approach 2:
The patent transitions from a planar wire-based connection system to a vertical/three-dimensional conductive structure embedded within the substrate. The conductive portions extend through the substrate thickness direction, allowing electrical connections without requiring horizontal wire routing, thus enabling reduced sealing resin thickness.
2Length of moving object
If a thin lead frame is used to reduce device thickness, then device size is reduced, but warping occurs in the metal plate
Solution Approach 1:
The patent removes the lead frame metal plate structure entirely and replaces it with a substrate-integrated conductive system. This eliminates the warping issue inherent in thin metal plates while achieving the same electrical connection function through conductive portions formed on or within the substrate.
Solution Approach 2:
The patent changes the material and structural parameters of the support structure. Instead of using a thin metal lead frame prone to warping, the invention employs a substrate with embedded conductive portions, fundamentally altering the physical properties and dimensional stability of the device structure.
3Reliability
If electroless plating is used for second electrodes, then mounting reliability improves and metal burrs are reduced, but additional manufacturing steps are required
Solution Approach 1:
The patent applies electroless plating to the second electrodes in advance during the manufacturing process, before final assembly and mounting. This preliminary treatment ensures that the electrodes have optimal surface properties for mounting while eliminating metal burrs, thereby improving mounting reliability without adding complex post-processing steps.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution allows for a thinner semiconductor device without the limitations of traditional lead frame structures, reducing the generation of metal burrs and improving mounting reliability, while maintaining effective electrical connections.
Implementation Method 1
a first electrode that includes a first conductive portion and a second conductive portion, where the first conductive portion is formed on a portion of the first front surface, and the second conductive portion is connected to the first conductive portion and overlaps with the first substrate as viewed in a first direction perpendicular to the thickness direction
Implementation Method 2
a grinding step of grinding the base from the back surface toward the front surface in the thickness direction to expose the second conductive portion
Implementation Method 3
a second electrode exposed from the sealing resin and electrically connected to the first electrode. The second electrode is in contact with the second conductive portion
Data Source
AI summary
A semiconductor device includes a semiconductor element, a first substrate, a first electrode, a second electrode and a sealing resin. The first substrate has a first front surface and a first back surface that are spaced apart from each other in a thickness direction. The semiconductor element is mounted on the first main surface. The first electrode includes a first conductive portion and a second conductive portion. The first conductive portion is formed on a portion of the first front surface. The second conductive portion is connected to the first conductive portion and overlaps with the first substrate as viewed in a first direction perpendicular to the thickness direction. The sealing resin covers the semiconductor element. The second electrode is exposed from the sealing resin and electrically connected to the first electrode. The second electrode is in contact with the second conductive portion.