Semiconductor Die Dual Controller Thermal Management

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Solution Overview

Problem

Semiconductor chips face operational challenges and increased power consumption when temperatures exceed a certain range, leading to potential chip damage and reliability issues, as they are typically designed to operate within a narrower temperature range than their maximum process temperature.

Innovation Solution

Incorporating multiple controllers within the semiconductor die, where a primary controller manages circuit modules at normal temperatures and a secondary controller is enabled to disable these modules when temperatures exceed a threshold, reducing heat dissipation, and vice versa when temperatures drop below the threshold, allowing for extended temperature range operation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If the semiconductor die operates at elevated temperatures beyond the designed temperature range, then the operational range is extended, but power consumption increases and functional inoperability occurs

Engineering Contradiction:

Improvetemperature rangeVSAvoidfunctional inoperability

Core Design Contradiction:

Adaptability or versatilityVSReliability

Solution Approach 1:

The controller is divided into a primary controller and a secondary controller. The primary controller handles normal operations within the designed temperature range, while the secondary controller takes over at elevated temperatures to manage power consumption and maintain functionality, thus extending the operational temperature range without sacrificing reliability

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The system dynamically changes operational parameters by switching between primary and secondary controllers based on temperature conditions. The secondary controller is specifically designed to operate at elevated temperatures with adjusted power management parameters, allowing the semiconductor die to adapt to different temperature environments while maintaining reliable operation

Inventive Principle:

Principle #35Parameter changes

2Adaptability or versatility

If the semiconductor die operates at elevated temperatures, then the temperature range is extended, but heat dissipation increases leading to potential chip damage

Engineering Contradiction:

Improvetemperature rangeVSAvoidheat dissipation

Core Design Contradiction:

Adaptability or versatilityVSObject-affected harmful factors

Solution Approach 1:

The secondary controller implements dynamic parameter adjustments including reducing operating frequency, disabling non-essential circuit modules, and optimizing power distribution to minimize heat generation while maintaining essential functions at elevated temperatures

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The system continuously monitors temperature conditions and dynamically switches between primary and secondary controllers based on real-time thermal feedback. This feedback mechanism allows the system to adjust power consumption and heat dissipation levels appropriately for the current temperature environment

Inventive Principle:

Principle #23Feedback

3Adaptability or versatility

If a single controller is used to manage all circuit modules, then the device complexity is low, but the ability to operate over extended temperature ranges is limited

Engineering Contradiction:

Improvetemperature rangeVSAvoidcontroller architecture

Core Design Contradiction:

Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The controller functionality is segmented into primary and secondary controllers with distinct roles. The primary controller manages normal operations with full functionality, while the secondary controller provides specialized high-temperature operation with selective circuit module control, achieving extended temperature range without requiring complete redesign of the entire control architecture

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Both primary and secondary controllers are designed to perform overlapping but specialized functions. The secondary controller can take over critical control functions when the primary controller is disabled due to high temperature, providing multi-functional capability that ensures operation across extended temperature ranges

Inventive Principle:

Principle #6Universality (Multi-functionality)

Data Source

PatentUS11101638B2Semiconductor die including multiple controllers for operating over an extended temperature range

Publication Date: 2021.08.24 ANALOG DEVICES INT UNLTD CO

AI summary

Provided herein are semiconductor dies including multiple controllers for operating over an extended temperature range. In certain embodiments, a semiconductor die includes multiple circuit modules, a temperature sensor that generates a detected temperature signal, an interface that communicates with an external host, a primary controller coupled to the interface and operable to control the circuit modules, and a secondary controller coupled to the interface. In response to the detected temperature signal indicating that the temperature of the semiconductor die exceeds a threshold temperature, the primary controller enables the secondary controller, which in turn disables the primary controller and at least a portion of the plurality of circuit modules to reduce heat dissipation.