Semiconductor Die Lead Frame Direct Attachment
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Solution Overview
Problem
Conventional power electronic modules have size limitations and reliability issues due to the need for additional components like wire bonds and molded packages, which affect thermal dissipation and mechanical stability when mounting semiconductor dies on circuit carriers.
Innovation Solution
Direct attachment of lead frames to the semiconductor die provides both electrical connection and mechanical support, allowing for reduced size, improved thermal dissipation, and enhanced reliability by eliminating the need for wire bonds and molded packages, with options for attachment methods like silver sintering, conductive gluing, or welding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If wire bonds and molded packages are used to connect semiconductor die to lead frames, then electrical connection and mechanical support are provided, but the overall size increases and thermal dissipation is reduced
Solution Approach 1:
The patent extracts and eliminates the wire bonds and molded package from the conventional structure, directly attaching the lead frame to the semiconductor die. This removal of intermediate components reduces overall size while maintaining electrical connection through the direct lead frame-die attachment interface.
Solution Approach 2:
The patent merges the functions of wire bonds, molded packages, and lead frames into a single integrated lead frame structure that provides both electrical connection and mechanical support directly to the semiconductor die, eliminating the need for separate components.
2Temperature
If wire bonds and molded packages are used, then electrical connection is established, but thermal dissipation capability deteriorates
Solution Approach 1:
The patent removes the wire bonds and molded package that impede thermal dissipation, allowing heat to flow more efficiently from the semiconductor die through the lead frame to the heat sink or PCB, thereby improving thermal management.
Solution Approach 2:
The patent employs a lead frame with composite material properties that provide both electrical conductivity and enhanced thermal dissipation capabilities, integrating multiple functions into a single component with optimized material characteristics.
3Reliability
If additional components like wire bonds and molded packages are used, then electrical connection is provided, but mechanical stability under thermal and mechanical stress decreases
Solution Approach 1:
The patent extracts and eliminates wire bonds and molded packages that create mechanical stress concentration points and failure interfaces, leaving a simpler direct-attachment structure that better withstands thermal cycling and mechanical vibrations.
Solution Approach 2:
The patent combines the electrical connection and mechanical support functions into a single integrated lead frame attachment structure, reducing the number of interfaces and potential failure points while improving overall mechanical stability under stress.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach results in a smaller, more reliable semiconductor element with improved thermal dissipation and mechanical stability, capable of withstanding thermal and mechanical stresses, such as those from power cycles and vibrations.
Implementation Method 1
attachment methods like silver sintering, conductive gluing, or welding
Implementation Method 2
improved thermal dissipation
Implementation Method 3
capable of withstanding thermal and mechanical stresses, such as those from power cycles and vibrations
Data Source
AI summary
A semiconductor element to be mounted on a circuit carrier includes a semiconductor die and at least one lead frame. In order to reduce the size required for mounting a semiconductor die on a circuit carrier, a semiconductor element includes a semiconductor die and at least one lead frame. The at least one lead frame is directly attached to the semiconductor die at a connection region of the semiconductor die, and the connection region provides an electrical connection to and mechanical support for the semiconductor die.