Semiconductor Die Package Clip Structure for Heat Dissipation
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Solution Overview
Problem
Conventional semiconductor die packages face challenges in miniaturization, which affects performance and increases contact resistance, and they lack efficient heat dissipation and robust interconnection options, particularly for devices like wireless phones.
Innovation Solution
A semiconductor die package design featuring a semiconductor die with a leadframe structure on one surface and a clip structure with a bent lead portion on the opposite surface, which is substantially coplanar with the leadframe, allowing for improved connections and heat dissipation through a molding material covering and a heat transfer element.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the semiconductor die package size is reduced, then the package can be incorporated into smaller electronic devices, but the semiconductor die size must also be reduced which impacts performance and increases contact resistance
Solution Approach 1:
The lead structure extends beyond the package boundaries in a dimensional extension approach, allowing the electrical connection point to be located outside the compact package volume. This enables small package size while maintaining low contact resistance through the extended lead that reaches to larger external connection points.
2Volume of moving object
If the semiconductor die package size is reduced, then the package can be incorporated into smaller electronic devices, but the performance of the semiconductor die is impacted due to size constraints
Solution Approach 1:
The lead structure provides a dimensional extension that separates the compact package volume from the electrical connection interface. This allows the semiconductor die to maintain optimal performance characteristics while the overall package footprint remains small, as the lead extends the electrical connection to external points.
3Ease of manufacture
If conventional package designs are used, then manufacturing is simpler, but heat dissipation properties are insufficient for power transistors that generate significant heat
Solution Approach 1:
The lead structure serves as a thermal intermediary, conducting heat away from the semiconductor die to external heat sinks. This mediator approach allows the package to maintain simple manufacturing processes while effectively managing heat dissipation through the lead's thermal conduction path.
4Device complexity
If conventional package designs are used, then the structure is simpler, but robust interconnection options are not provided for end users
Solution Approach 1:
The extended lead structure provides additional dimensional freedom for interconnection, allowing multiple routing options and connection configurations. This simple yet effective approach enhances interconnection versatility without significantly increasing structural complexity.
Data Source
AI summary
A semiconductor die package, and methods of making the same. The package includes a leadframe and a clip structure. The clip structure is formed, such that a portion of the clip structure points towards the semiconductor die and is coplanar with the leadframe. The semiconductor die package further includes a housing material covering at least a portion of the leadframe, the semiconductor die, and the clip structure. The housing material has an external recess that holds a portion of the clip structure.