Semiconductor Diode Channel Region for Surge Current

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Solution Overview

Problem

Semiconductor devices, such as field effect transistors and diodes, face challenges in optimizing surge current capability and soft switching behavior due to uneven excess charge carrier distribution, which affects their operational characteristics.

Innovation Solution

The semiconductor device incorporates a drift region and a first semiconductor region electrically coupled to a terminal via a surface, with a channel region of a second conductivity type formed in a trench, allowing for improved charge carrier distribution and enhanced surge current capability and soft switching behavior by adjusting the channel region's dimensions and doping profiles.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a conventional semiconductor diode structure is used, then the device is simple to manufacture, but the surge current capability and soft switching behavior are insufficient due to uneven charge carrier distribution

Engineering Contradiction:
Improvesurge current capabilityVSAvoiddevice structure
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The semiconductor body is divided into distinct regions including a drift region, a first semiconductor region, and a channel region with different conductivity types. This segmentation allows each region to be optimized for specific functions, improving charge carrier distribution and surge current capability while maintaining manufacturability through standardized region formation processes

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Different regions of the semiconductor device are doped with different conductivity types and doping concentrations to create locally optimized properties. The channel region has a second conductivity type adjacent to the first semiconductor region, creating localized electric field control that enhances soft switching behavior without requiring complete redesign of the entire device structure

Inventive Principle:
Principle #3Local quality

2Reliability

If the charge carrier distribution is uniformly distributed, then the device structure is simple, but the soft switching behavior and surge current capability are degraded

Engineering Contradiction:
Improvesoft switching behaviorVSAvoidcharge carrier distribution control
Core Design Contradiction:
ReliabilityVSManufacturing precision

Solution Approach 1:

The patent implements non-uniform charge carrier distribution by creating a channel region with second conductivity type adjacent to the first semiconductor region. This local doping variation creates controlled electric fields that facilitate soft switching behavior and improve surge current capability, achieved through precise doping processes during manufacturing

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The patent utilizes changes in doping concentration and conductivity type parameters across different regions to control charge carrier distribution. By adjusting the doping profiles in the drift region, first semiconductor region, and channel region, the device achieves optimized soft switching behavior and surge current capability

Inventive Principle:
Principle #35Parameter changes

Data Source

PatentUS8860025B2Semiconductor device and method for manufacturing the semiconductor device
Publication Date: 2014.10.14 INFINEON TECHNOLOGIES AG
  • US8860025B2 patent drawing
  • US8860025B2 patent drawing
  • US8860025B2 patent drawing

AI summary

A semiconductor device includes a semiconductor diode. The semiconductor diode includes a drift region and a first semiconductor region of a first conductivity type formed in or on the drift region. The first semiconductor region is electrically coupled to a first terminal via a first surface of a semiconductor body. The semiconductor diode includes a channel region of a second conductivity type electrically coupled to the first terminal, wherein a bottom of the channel region adjoins the first semiconductor region. A first side of the channel region adjoins the first semiconductor region.