Semiconductor Package Drain Electrode Groove for Gas Bubble Discharge
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Solution Overview
Problem
In surface mount type semiconductor packages, gas bubbles often remain inside the solder due to the large mounting surface of the drain electrode being surrounded by resin with poor solder wettability, leading to increased electric resistance and potential contact failures.
Innovation Solution
Incorporating a groove on the mounting surface of the drain electrode that communicates with the outside of the sealing resin member, allowing gas bubbles to be easily discharged during solder solidification, while maintaining insulation and preventing moisture ingress.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of moving object
If the drain electrode has a large mounting surface to reduce package size, then miniaturization is achieved, but gas bubbles remain inside the solder leading to increased electric resistance
Solution Approach 1:
The patent divides the mounting surface into two distinct regions: a first region with poor solder wettability (surrounded by resin) and a second region with good solder wettability (exposed surface). This segmentation allows the electrode to maintain a large overall area for miniaturization while creating a specific zone that facilitates solder flow and gas bubble discharge, thereby reducing electric resistance and improving reliability.
2Reliability
If the mounting surface is surrounded by resin for insulation, then electrode isolation is improved, but solder wettability deteriorates causing gas bubble formation
Solution Approach 1:
The patent applies different surface properties to different regions of the same electrode. The first region is designed with poor solder wettability and is surrounded by resin for insulation, while the second region is designed with good solder wettability as an exposed surface. This local differentiation allows the electrode to simultaneously achieve good insulation where needed and effective solder bonding where required, preventing gas bubble formation while maintaining electrical isolation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively reduces the occurrence of gas bubbles within the solder, enhances insulation between electrodes, and suppresses solder deterioration, thereby improving the reliability of semiconductor packages.
Implementation Method 1
a groove provided on a first main face. The groove includes a first connection portion connected to a first end portion, and a second connection portion connected to a lateral face of the sealing resin member
Data Source
AI summary
According to one embodiment, a semiconductor package includes a semiconductor chip, a sealing resin that has a flat plate shape and seals the semiconductor chip inside, a first electrode that includes a first mounting surface exposed on a first main face of the sealing resin, a second electrode that includes a second mounting surface exposed on the first main face, and a groove provided on the first main face. The first mounting surface includes a first end portion arranged in an inner region of the first main face and opposed to the second electrode. The groove includes a first connection portion connected to the first end portion, and a second connection portion connected to a lateral face of the sealing resin.