Semiconductor Package with Dual-Substrate Segmentation for Thermal Management
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Solution Overview
Problem
The trend towards higher power semiconductor devices in electric vehicles and hybrid-electric vehicles poses challenges in producing semiconductor device packages that can handle higher current/power ratings, provide low impedance, and achieve high thermal dissipation while ensuring electrical isolation and efficient printed circuit board layout.
Innovation Solution
The solution involves a semiconductor device package design with dual-sided cooling, using direct-bonded metal substrates and a leadframe with multiple portions, allowing for flip-chip mounting of semiconductor dies and spacers to create electrical isolation and efficient thermal dissipation, along with a method of assembly that includes coupling substrates and leadframes to achieve low impedance and longer creepage distances.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If higher power semiconductor devices are used to increase current/power ratings, then power capability is improved, but thermal dissipation becomes more difficult and impedance increases
Solution Approach 1:
The package is divided into two separate substrates (first substrate and second substrate) that are electrically isolated from each other. Each substrate carries specific power semiconductor devices and connects to specific leadframe portions, allowing independent thermal management paths while maintaining electrical isolation. This segmentation enables better thermal dissipation for high-power devices by providing dedicated thermal pathways.
Solution Approach 2:
The patent transitions from a single-substrate architecture to a dual-substrate three-dimensional arrangement with vertical stacking. The first and second substrates are positioned at different vertical levels and connected through isolated pathways, utilizing the vertical dimension to create separate thermal and electrical pathways. This dimensional change enables independent thermal management while maintaining electrical isolation.
2Power
If higher power semiconductor devices are used to increase current/power ratings, then power capability is improved, but electrical impedance increases
Solution Approach 1:
The leadframe is segmented into multiple portions (first leadframe portion, second leadframe portion, third leadframe portion) that are electrically isolated. Each substrate connects to specific leadframe portions, creating separate electrical pathways. This segmentation allows optimization of current paths for high-power applications while maintaining low impedance through dedicated connection routes.
3Power
If multiple semiconductor devices are integrated in a single package, then power capability is improved, but electrical isolation between devices becomes more difficult
Solution Approach 1:
The package is segmented into two electrically isolated substrates, each hosting specific power semiconductor devices. The substrates are connected through isolated pathways that prevent electrical interference while allowing thermal management. This segmentation ensures robust electrical isolation between high-voltage and low-voltage devices within the same package.
Solution Approach 2:
The patent introduces isolated connection pathways and spacing structures as intermediaries between the first and second substrates. These intermediaries provide physical separation and electrical isolation while allowing controlled thermal and electrical connections where needed. The intermediaries enable multiple devices to coexist in the same package without electrical interference.
4Device complexity
If traditional single-substrate packaging is used, then device complexity is low, but thermal dissipation and electrical isolation performance are insufficient for high-power applications
Solution Approach 1:
The traditional single-substrate package is segmented into two separate substrates with distinct functions. Each substrate is optimized for specific thermal and electrical requirements, allowing independent thermal management pathways. This segmentation significantly improves thermal dissipation performance while maintaining manageable complexity through modular design.
Data Source
AI summary
In a general aspect, an apparatus can include a leadframe. The apparatus can also include a first semiconductor die coupled with a first side of a first portion of the leadframe, and a second semiconductor die coupled with a second side of the first portion of the leadframe. The apparatus can also include a first substrate coupled with a second side of the first semiconductor die. The first substrate can be further coupled with a first side of a second portion of the leadframe and a first side of a third portion of the leadframe. The apparatus can also further include a second substrate coupled with a second side of the second semiconductor die. The second substrate can be further coupled with a second side of the second portion of the leadframe and a second side of the third portion of the leadframe.