Semiconductor Package Dummy Conductors Loading Effect
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Solution Overview
Problem
Conventional semiconductor packaging processes face challenges in achieving uniformity of conductive bumps due to the loading effect, leading to defects and failures in semiconductor packages, necessitating more reliable and creative packaging techniques.
Innovation Solution
The introduction of dummy conductors formed alongside electrical connectors during the semiconductor manufacturing process to alleviate the loading effect, ensuring uniform critical dimensions and improving the uniformity of electrical connectors through deposition processes and subsequent encapsulation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional plating and etching processes are used to form conductive bumps, then the manufacturing process is simple, but uniformity issues occur due to the loading effect
Solution Approach 1:
The patent applies preliminary action by forming dummy conductors alongside the electrical connectors during the deposition process. These dummy conductors are created in advance to compensate for the loading effect that occurs during subsequent etching processes. By pre-establishing these compensatory structures, the patent ensures uniform critical dimensions and improved uniformity of the electrical connectors without requiring complex process modifications.
2Manufacturing precision
If dummy conductors are added to alleviate the loading effect, then uniformity of electrical connectors is improved, but device complexity increases
Solution Approach 1:
The patent uses dummy conductors as intermediary elements that mediate between the deposition process and the final electrical connector structures. These dummy conductors serve as compensatory structures that absorb the loading effect's adverse impacts during etching. By introducing these intermediary elements, the patent achieves uniform electrical connectors while managing the added structural complexity through systematic integration into the existing device architecture.
3Reliability
If conventional etching processes are used, then the manufacturing process is fast, but defects occur due to the loading effect
Solution Approach 1:
The patent applies preliminary action by incorporating dummy conductors during the deposition stage before etching. This preliminary structuring compensates for the loading effect that would otherwise cause defects during the etching process. By preparing these compensatory structures in advance, the patent enables the use of conventional fast etching processes while maintaining high reliability and avoiding defects, thus not increasing the manufacturing cycle time.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the uniformity and reliability of electrical connectors, reducing defects and improving the overall manufacturing yield by mitigating the adverse impacts of the loading effect during the etching process.
Implementation Method 1
The introduction of dummy conductors formed alongside electrical connectors during the semiconductor manufacturing process to alleviate the loading effect, ensuring uniform critical dimensions and improving the uniformity of electrical connectors through deposition processes
Data Source
AI summary
A semiconductor package and a manufacturing method thereof are provided. The semiconductor package includes a first semiconductor die, an insulating encapsulation laterally encapsulating the first semiconductor die, and a redistribution structure disposed on the first semiconductor die and the insulating encapsulation. The first semiconductor die includes a first contact region and a first non-contact region in proximity to the first contact region. The first semiconductor die includes a first electrical connector disposed on the first contact region and a first dummy conductor disposed on the first non-contact region, and the first electrical connector is electrically connected to a first integrated circuit (IC) component in the first semiconductor die. The first electrical connector is electrically connected to the redistribution structure, and the first dummy conductor is electrically insulated from the first IC component in the first semiconductor die and the redistribution structure.