Semiconductor Electrode Displacement Detection via Conduction State

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Solution Overview

Problem

Existing methods for aligning semiconductor elements with micro-chips are prone to location displacement issues, which can affect electrical characteristics and are difficult to verify through visual means, especially in micro-chips controlled by infinitesimal currents, leading to potential malfunctions and inefficiencies in alignment processes.

Innovation Solution

A location displacement detection method that determines alignment by analyzing the conduction state between the semiconductor element's electrode pads and the device's electrodes, using short circuit, open circuit states, and resistance value changes to accurately detect and correct for displacement without visual alignment.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of operation

If visual alignment method using alignment marks is used, then alignment operation can be performed, but location displacement occurs and electrical conduction state cannot be verified

Engineering Contradiction:

Improvealignment operationVSAvoidlocation displacement detection

Core Design Contradiction:

Ease of operationVSMeasurement precision

Solution Approach 1:

The patent replaces the visual/mechanical alignment method with an electrical detection method. Instead of using alignment marks that require visual recognition, the invention uses electrical conduction state detection (short circuit, open circuit, resistance value changes) to determine alignment accuracy, thereby eliminating location displacement issues inherent in visual methods

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent introduces an electrical conduction detection mechanism as an intermediary to verify alignment. The detection unit measures electrical parameters (conductance, resistance) between electrode pads and electrodes, using these electrical signals as intermediaries to indirectly detect location displacement without requiring direct visual observation

Inventive Principle:

Principle #24Intermediary (Mediator)

2Manufacturing precision

If iterative correction and movement operations are performed to achieve infinitesimal alignment, then alignment precision is improved, but time and cost increase significantly

Engineering Contradiction:

Improvealignment precisionVSAvoidalignment process time

Core Design Contradiction:

Manufacturing precisionVSLoss of time

Solution Approach 1:

The patent performs preliminary electrical conduction detection after initial alignment to verify alignment accuracy before final bonding. This preliminary detection prevents the need for multiple iterative corrections, as the electrical measurement provides immediate feedback on whether alignment specifications are met

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The invention implements a feedback mechanism where the detection unit measures electrical conduction state and provides information about alignment accuracy. This feedback allows for single-step adjustment rather than multiple iterations, as the electrical measurement directly indicates whether alignment is within specifications

Inventive Principle:

Principle #23Feedback

3Ease of operation

If visual alignment method is used, then alignment can be performed, but reliability of electrical connection cannot be ensured

Engineering Contradiction:

Improvealignment operationVSAvoidelectrical connection reliability

Core Design Contradiction:

Ease of operationVSReliability

Solution Approach 1:

The patent replaces visual alignment verification with electrical conduction state detection. By measuring electrical parameters (short circuit, open circuit, resistance values) between electrode pads and electrodes, the system directly assesses electrical connection quality, ensuring reliability that visual methods cannot provide

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This method allows for precise and reliable detection of location displacement, enabling accurate electrical connection verification and reducing the complexity and cost associated with iterative alignment processes, thereby improving the reliability and efficiency of semiconductor element alignment.

Implementation Method 1

detecting the location displacement of the electrical connection portion of the device relative to the electrical connection portion of the semiconductor element, based on a conduction state between the electrical connection portion of the semiconductor element and the electrical connection portion of the device

Methodology Applied

Scientific EffectElectrical conduction: Conduction (electrical)

Data Source

PatentUS10991666B2Location displacement detection method, location displacement detection device, and display device

Publication Date: 2021.04.27 SHARP FUKUYAMA LASER CO LTD

AI summary

A location displacement of an electrode of a device relative to an electrode pad of a semiconductor element is detected based on a conduction state between the electrode pad of the semiconductor element and the electrode of the device. The electrode pad of the semiconductor element is segmented into multiple portions and a first pad through a fourth pad uniformly arranged. A location displacement detector determines that no location displacement has occurred when the electrode pad of the semiconductor element is conductive to the electrode of the device, and determines that a location displacement has occurred when the electrode pad of the semiconductor element is non-conductive to the electrode of the device.