Semiconductor Faraday Cage Package for Lightweight EMI Shielding
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Solution Overview
Problem
Conventional methods for electromagnetic interference (EMI) shielding in semiconductor devices are costly, heavy, and prone to corrosion, failing to provide effective protection against EMI emissions and external interference as device frequencies increase.
Innovation Solution
A semiconductor structure featuring a conductive top block and ground wires forming a Faraday cage, embedded within a mold compound, to shield semiconductor chips, using mature fabrication processes and materials like metal plates or conductive polymers, with bond pads and ground wires to reduce contact resistance and cost.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If conventional metal cabinets, housings or cages are used for EMI shielding, then EMI protection is provided, but weight increases significantly
Solution Approach 1:
The patent uses thin conductive films (metal or conductive polymer) deposited on the semiconductor chip surface to provide EMI shielding. This thin film approach replaces heavy metal enclosures while maintaining shielding effectiveness, directly addressing the weight reduction need.
Solution Approach 2:
The patent employs composite structures combining semiconductor chips with conductive polymer materials or metal-doped polymers for EMI shielding. These composite materials provide both structural support and electromagnetic shielding functionality, reducing the need for separate heavy metal shielding components.
2Object-affected harmful factors
If conventional metal coatings are applied for EMI shielding, then EMI radiation is blocked, but fabrication cost increases
Solution Approach 1:
The patent changes the material parameters by using conductive polymers or metal-doped polymer films instead of traditional metal coatings. These materials can be deposited using lower-cost techniques such as spin coating, spray coating, or vapor deposition, reducing fabrication complexity and cost while maintaining EMI shielding performance.
Solution Approach 2:
The use of composite polymer-metal structures provides EMI shielding at lower cost than pure metal coatings. The polymer matrix reduces material cost and simplifies deposition processes, while embedded metal particles or layers provide the necessary conductive properties for EMI blocking.
3Object-affected harmful factors
If conventional metal shielding structures are used, then EMI protection is achieved, but corrosion problems occur in long term applications
Solution Approach 1:
The patent uses composite structures where corrosion-resistant polymer materials serve as the matrix, with metal particles or thin layers embedded for conductivity. The polymer matrix protects the metal components from direct environmental exposure, preventing corrosion while maintaining EMI shielding functionality through the conductive network.
Solution Approach 2:
The conductive polymer films or metal-doped polymer coatings form protective thin layers that are inherently corrosion-resistant. These films act as barriers between the semiconductor chip and the environment, providing both EMI shielding and long-term corrosion protection.
4Ease of manufacture
If traditional semiconductor package structures are used, then device fabrication is simplified, but EMI shielding protection is insufficient
Solution Approach 1:
The patent merges the EMI shielding function with the existing semiconductor package structure by depositing conductive films directly on the chip surface and integrating them with the packaging process. This combines multiple functions (shielding, structural support, and packaging) into a single integrated structure, maintaining fabrication simplicity while adding EMI protection.
Solution Approach 2:
The conductive polymer or metal-doped polymer layer serves multiple functions: it provides EMI shielding, acts as a protective coating, and can serve as an interconnect layer. This multi-functionality allows the same structure to address multiple requirements without adding separate components, maintaining fabrication simplicity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The structure provides lightweight, cost-effective EMI shielding, protecting semiconductor devices from internal and external interference while maintaining device performance and reducing fabrication complexity.
Implementation Method 1
The conductive top block, the plurality of ground wires, and the substrate form a Faraday cage to provide an electromagnetic interference shielding of the first die/die stack
Data Source
AI summary
The present disclosure provides a semiconductor structure, comprising a die/die stack attached on a substrate, a conductive top block covering a top surface of the die/die stack, and a plurality of ground wires conductively connect the conductive top block and to the substrate. The conductive top block, the plurality of ground wires, and the substrate form a Faraday cage to provide an electromagnetic interference shielding of the die/die stack.