Semiconductor Film with Differential Elasticity Modulus for Uniform Device Distribution
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Solution Overview
Problem
Semiconductor devices are not evenly distributed on adhesive films during expansion due to uncontrollable and uneven adhesive strength, and anisotropy in film materials, leading to displacement and uneven arrangements, especially in small-size devices.
Innovation Solution
A film with distinct adhesive and expansion areas, where the expansion area has a lower elasticity modulus than the adhesive area, designed to accommodate tensile deformation and ensure uniform distribution of semiconductor devices during fabrication, by controlling the elasticity modulus ratio and pattern distribution based on device cutting patterns.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If adhesive strength between device and film is increased to prevent displacement, then device distribution uniformity improves, but adhesive strength becomes harder to control and may cause stress concentration
Solution Approach 1:
The film is designed with different elasticity moduli in different areas: the adhesive area has a first elasticity modulus while the expansion area has a second elasticity modulus that is 1/5 to 1/2 of the first. This local differentiation allows the adhesive area to provide strong, controllable adhesion while the expansion area accommodates tensile deformation, resolving the contradiction between preventing displacement and maintaining controllability.
2Area of stationary object
If film material is stretched uniformly in all directions during expansion, then film coverage area increases, but anisotropy causes uneven tensile properties and device displacement
Solution Approach 1:
The film structure differentiates between adhesive areas (where devices are mounted) and expansion areas (connective regions). The expansion areas have lower elasticity modulus and are designed to bear tensile stress and undergo deformation, while adhesive areas maintain higher elasticity modulus to preserve device positions. This local quality differentiation allows uniform film expansion without compromising device position accuracy.
Solution Approach 2:
The film is segmented into multiple adhesive areas and expansion areas, with expansion areas forming a network between adhesive areas. This segmentation allows different regions to perform different functions: adhesive areas maintain devices while expansion areas accommodate overall film stretching, resolving the contradiction between film expansion and position accuracy.
3Manufacturing precision
If film elasticity modulus is increased to reduce deformation during expansion, then device displacement decreases, but film becomes brittle and may break under tensile stress
Solution Approach 1:
The film employs local quality differentiation with high elasticity modulus in adhesive areas for position stability and low elasticity modulus in expansion areas for tensile ductility. The expansion areas act as stress-absorbing zones that prevent crack propagation to adhesive areas, maintaining overall film strength while ensuring device position stability.
Solution Approach 2:
The expansion areas with lower elasticity modulus serve as pre-designed cushioning zones that absorb tensile stress before it reaches the adhesive areas. This beforehand cushioning prevents stress concentration and potential film breakage while maintaining device position stability in the adhesive areas.
4Strength
If adhesive area coverage is increased to improve device adhesion, then device attachment strength improves, but expansion capability of the film is reduced
Solution Approach 1:
The film is segmented into adhesive areas for device attachment and expansion areas for film expansion. The expansion areas form a connected network between adhesive areas, allowing the film to expand while maintaining device attachment strength. This segmentation resolves the contradiction by assigning different functions to different regions.
Solution Approach 2:
Different regions of the film have different elasticity moduli: adhesive areas have higher modulus for strong device attachment while expansion areas have lower modulus for film expansion capability. This local quality differentiation allows both strong adhesion and good expansion capability to coexist.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The film ensures more uniform and orderly distribution of semiconductor devices by allowing greater tensile deformation in the expansion area while maintaining strong adhesive properties, reducing displacement and interaction forces, especially for small-sized devices.
Implementation Method 1
elasticity modulus of the expansion area is less than that of the adhesive area; when tensile strength is applied on the film, the expansion area is more prone to tensile deformation than the adhesive area
Data Source
AI summary
A film for semiconductor device includes a base material and an adhesive layer formed over the base material. The film is divided into an adhesive area and an expansion area. The elasticity modulus of the expansion area is less than that of the adhesive area. When tensile strength is applied on the film, the expansion area is more prone to tensile deformation than the adhesive area. When this film is used for film expansion of semiconductor devices, the devices can be evenly and orderly arranged on the film.