Semiconductor Transport Fixture Retaining Latch and Pitch Adapter
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Solution Overview
Problem
The narrowing pitch of external connection terminals in ICs, particularly in BGA and LGA semiconductors, necessitates a reduction in testing socket contact pin pitch, increasing costs and risking IC drop-off during transportation in existing semiconductor transporting and testing fixtures.
Innovation Solution
A semiconductor transporting and testing fixture with a frame portion, a multi-layer bottom surface sheet having first and second pads for secure contact with the IC and testing socket, respectively, and a retaining latch to prevent IC drop-off, allowing for a wider contact pin arrangement in the testing socket.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If the pitch of external connection terminals in ICs is narrowed, then the integration and functionality of the IC is improved, but the pitch of contact pins in the testing socket must be narrowed accordingly, causing the cost of the testing socket to increase
Solution Approach 1:
The patent introduces a bottom surface sheet with pads as an intermediary component between the IC's external connection terminals and the testing socket's contact pins. This bottom surface sheet has a first pitch for contacting the IC terminals and a second pitch for contacting the testing socket pins, allowing the two different pitches to be connected without requiring the testing socket to match the narrow IC pitch directly
Solution Approach 2:
The patent uses a multi-layer bottom surface sheet structure where electrical connections are established not only vertically but also through horizontal conduction passages within the sheet. This dimensional approach allows signal transmission from the first pad (contacting IC) through internal conduction paths to the second pad (contacting testing socket), enabling pitch transformation
2Device complexity
If a retaining latch or thin device sustaining portion is used to grip the IC, then the structure is simplified, but the IC is likely to drop off during the transportation process
Solution Approach 1:
The patent employs a flexible bottom surface sheet that can deform to accommodate the IC and provide reliable electrical contact. The flexibility of this thin film structure allows it to conform to the IC position while maintaining secure contact, preventing drop-off without requiring complex rigid retaining mechanisms
Solution Approach 2:
The patent combines multiple functions into the bottom surface sheet: it serves as both the electrical contact interface (with pads and conduction passages) and as a mechanical support/retention element. This merging of electrical and mechanical functions eliminates the need for separate complex retaining structures while ensuring reliable IC positioning and contact
Data Source
AI summary
The semiconductor transporting and testing fixture according to the present invention comprises: a frame portion (21) adapted to receive therein an IC (5) having an external connection terminal, the frame portion having an inner peripheral wall; a bottom surface sheet (25) pasted on a bottom surface of the frame portion, the bottom surface sheet having an IC side pad (26) formed on a front surface thereof and a socket side pad (27) formed on a rear surface thereof, the IC side pad being adapted to contact the external connection terminal, the socket side pad electrically connected with the corresponding IC side pad and being adapted to contact a testing socket, wherein the frame portion (21) is provided with a retaining latch (23) protruding therefrom toward above the IC (5) when the IC (5) is received in the inner peripheral wall (22) of the frame portion (21).