Semiconductor Device Reducing Self-Inductance via Folded Metal Plate
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Solution Overview
Problem
Existing semiconductor devices face challenges in reducing self-inductance due to the configuration of terminals and the need for a creepage distance, which limits the effectiveness of reducing magnetic flux concentration.
Innovation Solution
A semiconductor device design that includes a resin case housing a semiconductor element, a parallel plate with insulating material, and a metal plate disposed between electrode lead-out portions, which relieves magnetic flux concentration and reduces self-inductance by using a non-magnetic metal plate made of materials like copper or aluminum alloy, positioned close to the electrodes to prevent high-frequency magnetic flux intrusion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If terminals are disposed close to each other with an insulating material therebetween, then self-inductance is reduced, but creepage distance requirements cannot be satisfied
Solution Approach 1:
The invention transitions from a two-dimensional planar arrangement of terminals to a three-dimensional configuration by introducing a folded plate structure. The first and second folded plates extend in different directions and are folded back toward each other, creating a spatial arrangement that reduces the distance between terminals in three-dimensional space while maintaining adequate creepage distance on the two-dimensional surface of the insulating resin case.
Solution Approach 2:
The folded plates are nested within the insulating resin case, with the plates being disposed inside the case and extending toward each other. This nesting allows the terminals to be positioned close together in three-dimensional space while the insulating resin case provides the necessary creepage distance on its surface, effectively nesting the terminal structure within the insulating enclosure.
2Reliability
If irregularities are provided on an upper surface of the resin case to secure creepage distance, then creepage distance is satisfied, but self-inductance reduction is limited
Solution Approach 1:
Instead of relying solely on surface irregularities in two dimensions, the invention uses three-dimensional folded plates that extend vertically and fold back toward each other. This creates a spatial pathway that reduces the effective distance for current flow in three-dimensional space, thereby reducing self-inductance more effectively than surface irregularities alone.
Solution Approach 2:
The terminal structure is segmented into multiple folded plates (first folded plate and second folded plate) with multiple folds each. These segmented plates are disposed at different positions and orientations, allowing the current path to be divided and redirected through multiple segments, which reduces the loop area and self-inductance while maintaining creepage distance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces self-inductance by relieving magnetic flux concentration between electrodes, allowing for a more significant reduction in self-inductance while maintaining a sufficient creepage distance and controlling manufacturing costs.
Implementation Method 1
Although magnetic flux easily concentrates in a portion between the two electrode lead-out portions in the parallel plate, the concentration of the magnetic flux is relieved by arranging the metal plate in the above region
Data Source
AI summary
A semiconductor device includes: a resin case that houses a semiconductor element; a parallel plate that is disposed inside the resin case while being connected with the semiconductor element, the parallel plate including two flat plates parallel to each other with an insulating material therebetween; two electrodes that are each led out from two electrode lead-out portions in an upper end of the parallel plate and are disposed on an upper surface of the resin case at a predetermined interval; and a metal plate that stands erect on the main surface of the flat plate in a region at the predetermined interval between the two electrode lead-out portions.