Semiconductor Package Frame Current Path Layout
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing semiconductor devices face limitations in layout flexibility and assembly ease due to interference between main current paths and wiring elements, requiring external connection members for circuit connection.
Innovation Solution
A semiconductor package design that includes a conductor substrate, semiconductor elements, a wiring element, a frame, and terminal blocks, where the frame serves as the main current path and is exposed from the sealing material, reducing interference and eliminating the need for external connection members, allowing for enhanced layout freedom and simplified assembly.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a wiring element is provided at the center of the semiconductor device to connect control terminals, then electrical connection is achieved, but the main current path and wiring element interfere with each other, limiting layout freedom
Solution Approach 1:
The patent separates the main current path (frame) and control wiring into different spatial dimensions by exposing them from opposite surfaces of the sealing material. The frame is exposed from the first surface while wiring elements connect to the second surface, eliminating interference and enabling independent routing in three-dimensional space.
2Reliability
If external connection members such as wire bonding or lead frames are used to connect source electrode to external circuit, then electrical connection is achieved, but device complexity increases
Solution Approach 1:
The patent merges the frame structure with the main current path function, where the frame itself serves as the electrical connection element. This integration eliminates the need for separate external connection members like wire bonds or lead frames, simplifying the overall device structure while maintaining reliable electrical connection.
Solution Approach 2:
The frame performs dual functions: providing structural support and serving as the main current path for electrical connection. This self-service approach eliminates the need for additional dedicated connection members, reducing device complexity while ensuring reliable electrical connectivity.
3Reliability
If separate connection members are required for main current path and control terminal connection, then electrical connection is achieved, but assembly ease is reduced
Solution Approach 1:
The patent combines the frame structure with the main current path function, creating an integrated component that requires no separate connection members. This merger significantly simplifies the assembly process while ensuring reliable electrical connection between the source electrode and external circuits.
Data Source
AI summary
Each of a plurality of semiconductor elements included in a semiconductor package includes a front-surface electrode being provided on a semiconductor substrate on a side opposite to a conductor substrate, a back-surface electrode being joined to the conductor substrate, a control pad configured to control current flowing between the front-surface electrode and the back-surface electrode, a frame being electrically connected to the front-surface electrode, a portion of the frame being exposed from a surface of a sealing material from which a lower surface of the conductor substrate is exposed, and a plurality of terminal blocks being electrically connected to a plurality of first pads, a portion of the plurality of terminal blocks being exposed from a surface of the sealing material, the surface being provided on a side opposite to the surface of the sealing material from which the lower surface of the conductor substrate is exposed.