Semiconductor Device Frame Portion for Thermal Grease Thickness Control
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Solution Overview
Problem
Conventional semiconductor devices with resin casings face challenges in achieving optimal thermal conduction between the metal base and heat-dissipation fins due to variations in thermal grease thickness, which affects heat dissipation efficiency.
Innovation Solution
A semiconductor device design featuring a metal base exposed at the lower surface with a frame portion that protrudes below the package portion, creating a consistent space for thermal grease, enhancing thermal conduction by reducing variations in grease thickness and improving contact with heat-dissipation fins.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If thermal grease is applied between the metal base and heat-dissipation fin set, then thermal conduction is improved, but the thickness of thermal grease varies causing inconsistent thermal conduction performance
Solution Approach 1:
The frame portion acts as an intermediary component between the package portion and the heat-dissipation fin set. By providing a standardized interface structure, it mediates the connection and ensures consistent thermal grease thickness, thereby improving thermal conduction consistency while reducing manufacturing precision requirements for direct metal base-to-fin-set contact.
Solution Approach 2:
The frame portion is pre-formed with a specific structure that defines the thermal grease application space before the actual thermal conduction assembly is completed. This preliminary structuring ensures that when thermal grease is applied, it maintains a consistent thickness, solving the issue of variable grease thickness that would otherwise require high manufacturing precision.
2Manufacturing precision
If the frame portion protrudes below the package portion, then thermal grease thickness is controlled, but the device structure becomes more complex
Solution Approach 1:
The frame portion serves multiple functions simultaneously: it provides structural support for the package portion, defines the thermal grease application space to control thickness, and acts as a mounting interface for the heat-dissipation fin set. By consolidating these functions into a single component, the design achieves precise thermal grease control without proportionally increasing overall device complexity.
3Reliability
If the metal base is exposed at the lower surface for heat dissipation, then thermal conduction to heat-dissipation fins is improved, but warping of the metal base occurs affecting assembly
Solution Approach 1:
The frame portion provides localized structural support at specific areas of the package portion, particularly at the lower surface where the metal base is exposed. This localized reinforcement counteracts warping forces in the critical heat dissipation region while maintaining the exposed metal base structure necessary for thermal conduction to the heat-dissipation fins.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design ensures consistent thermal conduction and reduced warping in semiconductor devices by maintaining a precise thermal grease thickness and improved contact with heat-dissipation fins, thereby enhancing heat dissipation efficiency.
Implementation Method 1
The frame portion may have springiness. When the frame portion is inserted along an inner wall of the penetration space, a restoring force may be generated in a direction to press the inner wall of the penetration space.
Implementation Method 2
thermal grease provided on the lower surface of the metal base
Data Source
AI summary
A space having a certain thickness is provided between a metal base and a heat-dissipation fin set or the like. A semiconductor device is provided, including: a package portion; a metal base which is housed in the package portion and is exposed at a lower surface of the package portion; a semiconductor chip which is housed in the package portion and is placed above the metal base; and a frame portion provided to surround a penetration space penetrating the package portion, wherein a lower end of the frame portion protrudes below the lower surface of the package portion and a lower surface of the metal base. It is preferable that the frame portion is inserted in the penetration space after the penetration space is formed in the package portion.