Semiconductor Fuse With Heat Dissipation Patterns

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Solution Overview

Problem

Conventional semiconductor ICs face layout inefficiencies due to the need for spacing between fuses and adjacent elements, and electrical fuses experience thermal stress that can alter properties of nearby semiconductor devices during rupture.

Innovation Solution

A semiconductor integrated circuit design featuring a pair of interconnections with a fuse connected to them, surrounded by heat dissipation patterns that manage and dissipate the high temperature generated during fuse rupture, reducing thermal impact on adjacent elements.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If electrical fuse is ruptured to repair error cells, then reliability is improved, but temperature rises to several thousand degrees causing thermal diffusion to adjacent elements

Engineering Contradiction:

Improveerror cell repair capabilityVSAvoidfuse rupture temperature

Core Design Contradiction:

ReliabilityVSTemperature

Solution Approach 1:

The patent introduces a heat dissipation pattern as an intermediary element between the fuse and adjacent semiconductor devices. This pattern acts as a thermal mediator that intercepts and redirects heat flow, preventing direct thermal diffusion to sensitive adjacent elements while allowing the fuse to rupture at high temperature for reliable error cell repair

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent converts the harmful high-temperature heat generated during fuse rupture into a beneficial thermal management opportunity by designing heat dissipation patterns that actively channel and dissipate this heat away from adjacent elements. The harmful thermal energy is transformed into a controlled heat flow that protects rather than damages surrounding components

Inventive Principle:

Principle #22Blessing in disguise (Convert harm into benefit)

2Reliability

If laser beams are used to blow fuse, then fuse rupture is achieved, but adjacent fuse line is affected requiring predetermined spacing

Engineering Contradiction:

Improvefuse rupture capabilityVSAvoidlayout density

Core Design Contradiction:

ReliabilityVSArea of stationary object

Solution Approach 1:

The patent replaces the optical/laser-based fuse blowing mechanism with an electrical blowing mechanism. This substitution eliminates the need for precise laser focusing and the associated spacing requirements, allowing fuses to be placed closer together and improving layout density while maintaining reliable fuse rupture capability through electrical current

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

3Object-affected harmful factors

If heat dissipation patterns are added around fuse, then thermal burden on adjacent cells is reduced, but device complexity increases

Engineering Contradiction:

Improvethermal burden on adjacent cellsVSAvoidfuse structure complexity

Core Design Contradiction:

Object-affected harmful factorsVSDevice complexity

Solution Approach 1:

The patent modifies the thermal parameters of the fuse structure by introducing heat dissipation patterns with specific geometric parameters (width, length, spacing) that optimize heat flow characteristics. By carefully controlling these parameters, the design achieves effective thermal management while keeping the added structural complexity minimal and manufacturable

Inventive Principle:

Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The heat dissipation patterns effectively lower the temperature of the ruptured fuse, preventing thermal burden on adjacent cells and improving layout efficiency by reducing thermal stress and maintaining device properties.

Implementation Method 1

one or more heat dissipation patterns connecting the pair of interconnections and are disposed around the fuse

Methodology Applied

Scientific EffectHeat dissipation: Conduction (thermal)

Implementation Method 2

The heat dissipation patterns effectively lower the temperature of the ruptured fuse

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 3

the fuse link blows due to an electromigration (EM) effect and Joule heating

Methodology Applied

Scientific EffectJoule heating: Joule Heating

Implementation Method 4

the fuse link blows due to an electromigration (EM) effect and Joule heating

Methodology Applied

Scientific EffectElectromigration:

Data Source

PatentUS8232619B2Semiconductor IC having electrical fuse capable of preventing thermal diffusion

Publication Date: 2012.07.31 MIMIRIP LLC

AI summary

Provided is a semiconductor integrated circuit. The semiconductor integrated circuit comprises: a pair of interconnections; a fuse connecting the pair of interconnections; and one or more heat dissipation patterns connecting the pair of interconnections and are disposed around the fuse.