Semiconductor Package Heat Block Alignment for Thermal Reliability

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Solution Overview

Problem

Existing semiconductor packages face challenges in aligning heat dissipation blocks effectively, leading to misalignment, reduced heat dissipation efficiency, and potential interference with peripheral components.

Innovation Solution

The semiconductor package incorporates heat dissipation blocks with protrusions and complementary concave portions on the redistribution structure, ensuring precise alignment through interlocking shapes, thereby improving thermal characteristics and reducing misalignment.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If the heat dissipation block is arranged on the semiconductor package without alignment features, then the manufacturing process is simpler, but the heat dissipation performance is reduced due to misalignment

Engineering Contradiction:

Improveease of manufactureVSAvoidheat dissipation performance

Core Design Contradiction:

Ease of manufactureVSReliability

Solution Approach 1:

The patent merges the alignment function with the heat dissipation block itself by integrating protrusions into the block and complementary concave portions into the redistribution structure. This combination allows the heat dissipation block to self-align during placement without requiring separate alignment features or complex manufacturing processes, thus maintaining ease of manufacture while improving heat dissipation performance through accurate positioning.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The heat dissipation block performs self-alignment through its own protrusions that automatically fit into the concave portions of the redistribution structure during the placement process. This self-service mechanism eliminates the need for external alignment aids or complex positioning systems, keeping the manufacturing process simple while ensuring reliable alignment and optimal heat dissipation performance.

Inventive Principle:

Principle #25Self-service

2Productivity

If the heat dissipation block is misaligned on the semiconductor package, then the manufacturing process is faster, but the thermal characteristics are degraded

Engineering Contradiction:

Improvemanufacturing speedVSAvoidthermal characteristics

Core Design Contradiction:

ProductivityVSTemperature

Solution Approach 1:

The alignment protrusions and concave portions are pre-formed as integral parts of the heat dissipation block and redistribution structure before the assembly process. This preliminary preparation allows for rapid self-alignment during placement without requiring additional alignment steps or adjustments, maintaining high manufacturing speed while ensuring accurate positioning for optimal thermal characteristics.

Inventive Principle:

Principle #10Preliminary action

3Manufacturing precision

If alignment protrusions are added to the heat dissipation block, then the alignment precision is improved, but the device complexity increases

Engineering Contradiction:

Improvealignment precisionVSAvoiddevice complexity

Core Design Contradiction:

Manufacturing precisionVSDevice complexity

Solution Approach 1:

The patent combines the alignment function with the heat dissipation block by integrating protrusions into the block structure and complementary concave portions into the redistribution structure. This merging approach achieves precise alignment without adding separate alignment mechanisms or components, thereby improving alignment precision while avoiding increased device complexity.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The alignment protrusions and concave portions are implemented as localized features only at the specific interfaces where alignment is needed, rather than modifying the entire heat dissipation block or redistribution structure. This local implementation achieves precise alignment while minimizing the impact on overall device complexity and maintaining simplicity in other areas of the structure.

Inventive Principle:

Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design enhances heat dissipation performance and reliability by aligning the heat dissipation blocks accurately, minimizing interference and reducing cracks in the redistribution layers, thus improving the overall thermal and structural integrity of the package.

Implementation Method 1

a heat transfer layer is provided between the heat dissipation block and the top surface of the upper redistribution structure

Methodology Applied

Scientific EffectHeat conduction: Conduction (thermal)

Data Source

PatentUS20260060076A1Semiconductor package

Publication Date: 2026.02.26 SAMSUNG ELECTRONICS CO LTD

AI summary

Provided is a semiconductor package including a first semiconductor device, an encapsulant surrounding the first semiconductor device, an upper redistribution structure provided on the encapsulant, and a heat dissipation block provided on the upper redistribution structure. The heat dissipation block includes a first block surface facing a top surface of the upper redistribution structure, the heat dissipation block includes a first protrusion on the first block surface, a first concave portion corresponding to the first protrusion is provided on the top surface of the upper redistribution structure, the first protrusion is located in the first concave portion, and a heat transfer layer is provided between the heat dissipation block and the top surface of the upper redistribution structure.