Semiconductor Device Heat Dissipation Member with Electromagnetic Wave Absorption
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Solution Overview
Problem
Semiconductor devices face challenges in effectively shielding electromagnetic waves and dissipating heat generated during high-frequency operations, leading to potential operation failures and increased component size due to mutual interference and heat buildup.
Innovation Solution
A semiconductor device design incorporating a wiring board, electronic component, heat dissipation member, and heat conduction member, where the heat conduction member includes an electromagnetic wave absorption sheet, a heat transfer sheet with conductive particles in resin, and a heat conduction plate, allowing for efficient absorption and dissipation of electromagnetic waves and heat through a structured heat conduction path.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a metal can is used to shield electromagnetic waves, then electromagnetic wave shielding is improved, but the mounting area increases and mutual interference occurs within the can
Solution Approach 1:
The invention extracts the electromagnetic wave shielding function from the metal can structure and implements it using electromagnetic wave absorptive materials directly applied to or near the electronic component, eliminating the need for a large enclosing metal can and reducing the mounting area while maintaining shielding effectiveness
Solution Approach 2:
The invention converts electromagnetic wave energy into heat energy through absorptive materials, transforming the harmful electromagnetic waves into a manageable form (heat) that can be dissipated, rather than reflecting them as a metal can would do
2Object-affected harmful factors
If electromagnetic wave absorptive materials are used, then electromagnetic wave absorption is improved, but heat dissipation becomes a challenge
Solution Approach 1:
The invention merges the electromagnetic wave absorption function and heat dissipation function into a single integrated structure where the absorptive material is thermally coupled to a heat dissipation member, allowing both functions to work together rather than separately
Solution Approach 2:
The invention introduces a heat dissipation member as an intermediary between the electromagnetic wave absorptive material and the environment, facilitating efficient heat transfer from the absorptive material to the surrounding area
3Area of stationary object
If electronic components are mounted with high density, then downsizing is achieved, but heat generation increases
Solution Approach 1:
The invention implements a self-service heat dissipation system where each electronic component has its own dedicated heat dissipation path through the heat dissipation member, allowing components to manage their own heat generation independently without requiring additional system-level cooling infrastructure
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables effective absorption of electromagnetic waves and efficient heat dissipation, reducing thermal resistance and preventing electromagnetic interference, thereby enhancing the reliability and performance of semiconductor devices in wireless communication apparatuses.
Implementation Method 1
an electromagnetic wave absorption sheet 11 arranged to contact an upper surface and side surfaces of the electronic component 3
Implementation Method 2
a heat conduction plate 13 arranged to contact a portion of the electromagnetic wave absorption sheet 11
Implementation Method 3
a heat transfer sheet 15 arranged to contact the heat conduction plate 13. The heat transfer sheet 15 has heat conductive particles added to a resin
Data Source
AI summary
An electromagnetic wave absorption sheet is arranged to contact an upper surface and side surfaces of an electronic component mounted on a wiring board, a heat conduction plate is arranged to contact the electromagnetic wave absorption sheet, a heat transfer sheet is arranged to contact the heat conduction plate, and a heat dissipation member is arranged to contact the heat transfer sheet. Heat conductive particles contained in the heat transfer sheet contact a flat surface portion of the heat conduction plate. The electromagnetic wave absorption sheet, the heat conduction plate, and the heat transfer sheet are interposed between the heat dissipation member and the electronic component, as a heat conduction member for conducting heat generated in the electronic component and the like to the heat dissipation member.