Semiconductor Heat Dissipation Layer Design
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Solution Overview
Problem
Semiconductor devices with semiconductor elements that generate significant heat face inefficiencies in heat dissipation due to the use of sealing resins with lower thermal conductivity than the Si substrate, leading to inadequate heat dissipation from the semiconductor element to the outside.
Innovation Solution
Incorporating a semiconductor device design with a first heat dissipation layer in contact with the element back surface and exposed from the sealing resin, and a second heat dissipation layer between the semiconductor element and the substrate, both made of materials with higher thermal conductivity, to enhance heat dissipation efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the semiconductor element is covered with sealing resin, then the semiconductor element is protected, but heat dissipation efficiency deteriorates due to lower thermal conductivity of sealing resin compared to Si substrate
Solution Approach 1:
The patent divides the heat dissipation function into two separate heat dissipation layers: a first heat dissipation layer covering the back surface of the semiconductor element, and a second heat dissipation layer disposed between the semiconductor element and the substrate. This segmentation allows heat to be dissipated through multiple pathways, bypassing the thermal resistance of the sealing resin while maintaining element protection.
Solution Approach 2:
The patent introduces heat dissipation layers as intermediary structures between the semiconductor element and the external environment. These layers serve as thermal conduits that facilitate heat transfer from the element to the substrate and exterior, mediating the thermal interaction while the sealing resin continues to provide protective encapsulation.
2Temperature
If heat dissipation layers are added to improve thermal management, then heat dissipation efficiency improves, but device complexity increases
Solution Approach 1:
The patent combines the heat dissipation function with the existing protective sealing structure. The first heat dissipation layer is integrated with the sealing resin configuration, and the second heat dissipation layer is incorporated into the substrate interface design. This merging approach allows thermal management to be achieved without fundamentally altering the basic device architecture.
Solution Approach 2:
The heat dissipation layers serve multiple functions: they provide thermal conduction pathways, act as additional protective barriers, and can serve as structural support layers. This multi-functionality reduces the need for separate dedicated heat dissipation components, thereby limiting the increase in device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design effectively dissipates heat from the semiconductor element to the outside through both the first and second heat dissipation layers, improving thermal management and reducing the device's height while maintaining manufacturing efficiency.
Implementation Method 1
a first heat dissipation layer that is held in contact with the element back surface and exposed from the sealing resin
Implementation Method 2
a second heat dissipation layer that is disposed between the semiconductor element and the substrate
Data Source
AI summary
A semiconductor device includes a semiconductor element, a wiring portion, an electrode pad, a sealing resin and a heat dissipation layer. The semiconductor element has a front surface and a back surface opposite to the front surface in a thickness direction of the semiconductor device. The wiring portion is electrically connected to the semiconductor element. The electrode pad is electrically connected to the wiring portion. The sealing resin covers the semiconductor element. The heat dissipation layer is held in contact with the back surface of the semiconductor element and exposed from the sealing resin. The semiconductor element overlaps with the first heat dissipation layer as viewed in the thickness direction.