Semiconductor Device Heat Radiation and Electromagnetic Suppression
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Solution Overview
Problem
Conventional semiconductor devices face challenges in achieving both excellent heat radiation performance and electromagnetic wave suppression due to the interference caused by metal heat radiation components acting as antennas for harmonic noise components.
Innovation Solution
A semiconductor device design featuring a conductive shield can connected to ground with an opening hole, a heat conductive sheet passing through the hole to connect the semiconductor element and a conductive cooling member, and a conductive member between the shield and cooling member for electrical connection, enhancing both heat radiation and electromagnetic wave suppression.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a metal heat radiation component is located near the electronic component, then heat radiation performance is improved, but electromagnetic wave suppression deteriorates because the metal component acts as an antenna for harmonic noise
Solution Approach 1:
The heat radiation component is divided into multiple independent heat radiation fins rather than using a single continuous metal structure. This segmentation reduces the antenna effect and harmonic noise generation while maintaining heat radiation efficiency through the distributed fin structure.
Solution Approach 2:
A non-conductive adhesive layer is introduced as an intermediary between the electronic component and the heat radiation component. This adhesive layer electrically isolates the two components, preventing the heat radiation component from acting as an antenna for electromagnetic waves while still allowing thermal conduction through its thermally conductive properties.
2Object-generated harmful factors
If a conductive shield can with opening holes is used to maintain electromagnetic wave suppression, then electromagnetic wave absorption is maintained, but heat radiation performance deteriorates due to reduced thermal conduction path
Solution Approach 1:
The heat radiation component uses a composite structure combining conductive materials for heat radiation with non-conductive adhesive materials for electromagnetic isolation. This composite approach allows simultaneous achievement of heat radiation performance and electromagnetic wave suppression.
Solution Approach 2:
The electronic component is nested within the conductive shield can structure, with the heat radiation component positioned between them. The opening holes in the shield can are strategically positioned to allow heat conduction paths while maintaining electromagnetic shielding effectiveness.
3Temperature
If the conductive shield can has opening holes to allow heat conduction, then heat radiation performance is improved, but electromagnetic wave suppression deteriorates due to reduced shielding effectiveness
Solution Approach 1:
The conductive shield can has opening holes positioned at specific locations that do not compromise the overall electromagnetic shielding effectiveness. The openings are strategically placed to allow heat conduction paths while maintaining the integrity of the electromagnetic shield in critical areas.
Solution Approach 2:
The non-conductive adhesive material serves as an intermediary that allows thermal energy transfer while blocking electromagnetic wave propagation. This mediator enables simultaneous achievement of heat radiation and electromagnetic suppression despite the presence of opening holes in the shield can.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively improves heat radiation performance while maintaining electromagnetic wave suppression, even when the conductive shield has an opening hole, by forming an electrically closed region and utilizing materials with high electromagnetic wave absorption and conductivity.
Implementation Method 1
a heat conductive sheet formed between the semiconductor element and the conductive cooling member at least through the opening hole hole
Implementation Method 2
by providing a conductive member between the upper surface of the conductive shield can and the lower surface of the conductive cooling member and electrically connecting the conductive shield can and the conductive cooling member, electromagnetic wave suppression effect can be improved
Data Source
AI summary
Provided is a semiconductor device having excellent heat radiation performance and electromagnetic wave suppression effect. A semiconductor device 1 comprises: a semiconductor element 30 formed on a substrate 50; a conductive shield can 20 having an opening hole 21; a conductive cooling member 40 located above the conductive shield can 20; a heat conductive sheet 10 formed between the semiconductor element 30 and the conductive cooling member 40 at least through the opening hole 21; and a conductive member 11 electrically connecting the conductive shield can 20 and the conductive cooling member 40.