Semiconductor Module Heat Sink Layout for Low-Inductance Cooling
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Solution Overview
Problem
Existing semiconductor modules face challenges in integrating additional heat capacities, particularly under high and short-term overload conditions, leading to significant chip temperature fluctuations and reduced reliability.
Innovation Solution
A semiconductor module design featuring a metallic heat sink with a base body and ribs, thermally connected to the semiconductor element and electrically connected to a second substrate, utilizing a metallurgical bond for improved heat transfer and distribution, and a metallurgical connection for mechanical stabilization and increased contact area.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a semiconductor element is mounted on a substrate using a substrate mounting structure, then the semiconductor element can be fixed and electrically connected, but the parasitic inductance increases and current carrying capacity is limited
Solution Approach 1:
The patent extracts the semiconductor element from the traditional substrate mounting structure and directly mounts it on the heat sink. This eliminates the substrate mounting structure that causes parasitic inductance, while maintaining secure fixation through dedicated mounting holes and fastening mechanisms in the heat sink.
Solution Approach 2:
The heat sink serves as an intermediary structure that combines both mechanical support and thermal management functions. By integrating mounting holes directly into the heat sink, the patent creates a unified structure that eliminates the need for separate substrate mounting components, thereby reducing parasitic inductance while maintaining mounting stability.
2Reliability
If a substrate mounting structure is used to fix the semiconductor element, then the element is securely positioned, but the current carrying capacity is not sufficiently increased
Solution Approach 1:
The patent merges the thermal management function and mechanical support function into a single integrated heat sink structure. The heat sink includes both cooling channels for thermal management and mounting holes for secure fixation, eliminating the need for separate substrate mounting structures and enabling direct electrical connection that increases current carrying capacity.
Solution Approach 2:
The heat sink is designed as a multi-functional component that simultaneously provides thermal dissipation, mechanical support, electrical connection, and current conduction pathways. This universal structure increases current carrying capacity while maintaining secure element fixation without requiring additional specialized components.
3Reliability
If separate substrate and heat sink structures are used, then thermal management and electrical connection are achieved, but the overall structure becomes more complex
Solution Approach 1:
The patent combines the substrate mounting structure and heat sink into a single integrated component. The heat sink incorporates mounting holes, cooling channels, and electrical connection points, eliminating the need for separate substrate and heat sink assemblies. This reduces structural complexity while maintaining effective thermal management.
4Reliability
If conventional mounting structures are used, then the semiconductor element is fixed, but high-frequency signal transmission is degraded
Solution Approach 1:
The patent removes the substrate mounting structure that degrades high-frequency signal transmission. By directly mounting the semiconductor element on the heat sink with lower parasitic inductance, the patent maintains secure element fixation while improving signal transmission quality for high-frequency applications.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design enhances thermal conductivity and mechanical stability, reducing chip temperature fluctuations and improving the overall reliability of the semiconductor module under high and short-term overload conditions.
Implementation Method 1
The metallic heat sink is in a thermally conductive connection with the semiconductor element and is electrically conductively connected to the second substrate
Implementation Method 2
the base body has a contact surface surrounding the at least one rib, via which a metallurgical connection is established with the substrate metallization of the second substrate
Data Source
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AI summary
The invention relates to a semiconductor module (2) comprising at least one semiconductor element (4), a first substrate (8) and a second substrate (14). In order to achieve a greater degree of reliability in comparison to the prior art, the at least one semiconductor element (4) is on a first side (6) in planar contact with the first substrate (8) and on a second side (10), facing away from the first side (6), in planar contact with a metallic heat sink (12), the metallic heat sink (12) being in thermally conductive connection to the semiconductor element (4) and being connected in an electrically conductive manner.to the second substrate (14).