Semiconductor Heat Sink Segmentation for Productivity
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Solution Overview
Problem
The existing semiconductor devices with integrated heat sinks face challenges in productivity due to the need for tailored radiator fin sizes and numbers based on heat generation, requiring customized manufacturing processes that reduce efficiency and flexibility.
Innovation Solution
A semiconductor device design featuring a power module unit and a fin base with a heat radiation diffusion portion and base portion, where the power module unit is sealed with mold resin and integrated with the fin base using caulking, allowing for separate manufacturing and flexible fin placement based on heat density, improving productivity by standardizing the module base and varying the fin base configuration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If radiator fins are tailored to the heat generation amount (size and number), then heat radiation performance is improved, but manufacturing complexity increases and productivity decreases
Solution Approach 1:
The heat sink is divided into two separate components: a standardized module base and a customizable fin base. This segmentation allows the module base to be manufactured uniformly for all products, while only the fin base needs to be customized according to heat radiation requirements, thereby improving productivity while maintaining heat radiation performance.
Solution Approach 2:
The module base is designed as a universal component that can be used across different semiconductor devices regardless of heat generation amount. By making the module base multi-functional and standardized, the invention eliminates the need to customize the entire heat sink structure, thus resolving the contradiction between performance optimization and manufacturing efficiency.
2Temperature
If the base plate is fitted with customized radiator fins, then heat radiation efficiency is improved, but device complexity increases
Solution Approach 1:
The base plate is segmented into a module base and a fin base that are manufactured separately and then assembled. This segmentation simplifies the manufacturing process by allowing each component to be produced using standardized procedures, reducing device complexity while maintaining the ability to customize radiator fin configurations for optimal heat radiation efficiency.
3Productivity
If separate manufacturing of module base and fin base is implemented, then productivity is improved, but assembly process complexity increases
Solution Approach 1:
The assembly process merges the module base and fin base through a standardized joining operation. By designing the interfaces and joining methods in advance, the invention simplifies the assembly process despite separate manufacturing, thus improving productivity without significantly increasing assembly complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances productivity by allowing the use of a common module base for different heat densities, reducing manufacturing complexity and increasing flexibility in radiator fin placement, thereby improving heat radiation performance and reducing production time.
Implementation Method 1
The heat radiation diffusion portion is fitted with the radiator fin... to radiate heat generated from the power semiconductor element
Implementation Method 2
the other side of the base plate is fitted with a plurality of radiator fins to radiate heat generated from the power semiconductor element
Data Source
AI summary
A semiconductor device includes a power module unit, a fin base, and a plurality of radiator fins. The power module unit and the fin base are integrated together, with a recess-projection portion formed on the power module unit being fitted to a recess-projection portion formed on the fin base. The plurality of radiator fins are integrally fitted on a heat radiation diffusion portion of the fin base.