Semiconductor Package Heat Spreader Vertical Extension
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Solution Overview
Problem
Current semiconductor package designs face challenges in achieving effective heat dissipation and high integration while maintaining a compact, lightweight form factor, particularly in electronic systems that require efficient thermal management.
Innovation Solution
A semiconductor package design featuring a heat spreader with an upper plate, extension part, and lower plate, where the extension part has a greater vertical height than horizontal width, and a thermal interface material layer is used to dissipate heat generated from the semiconductor chip, preventing heat transfer to upper packages and efficiently dispersing it into the atmosphere.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a heat spreader is installed between the lower package and upper packages, then heat dissipation is improved, but device complexity increases
Solution Approach 1:
The heat spreader is divided into multiple functional parts: an upper plate for contacting upper packages, a lower plate for contacting the lower package, and extension parts that bridge between them. This segmentation allows each part to serve specific thermal management functions while maintaining structural integrity.
Solution Approach 2:
The heat spreader extends in the vertical dimension with extension parts that have greater vertical height than horizontal width, allowing thermal conduction pathways to extend through the package stack without increasing lateral footprint, thus improving heat dissipation in the vertical dimension.
2Productivity
If upper packages are positioned closer to the semiconductor chip for high integration, then productivity is improved, but heat transfer to upper packages increases
Solution Approach 1:
The heat spreader acts as a thermal intermediary between the semiconductor chip and upper packages. It provides controlled thermal pathways through extension parts, allowing upper packages to be positioned close for high integration while managing heat flow to prevent harmful thermal effects.
Solution Approach 2:
The heat spreader structure provides different thermal characteristics in different regions: extension parts with greater vertical height create localized thermal barriers or controlled conduction paths between the chip and upper packages, while maintaining close proximity for integration purposes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances heat dissipation and supports high integration by effectively channeling heat away from the semiconductor chip, reducing the distance between upper packages and improving thermal management in compact electronic systems.
Implementation Method 1
a thermal interface material layer is used to dissipate heat generated from the semiconductor chip, preventing heat transfer to upper packages
Data Source
AI summary
A lower package includes a semiconductor chip. A first upper package and a second upper package are disposed on the lower package. A heat spreader is disposed on the lower package. The heat spreader includes an upper plate and an extension part connected to the upper plate. At least a part of each of the first and second upper packages vertically overlaps the semiconductor chip. The upper plate may be arranged on the first upper package and the second upper package. The extension part may be arranged between the first upper package and the second upper package. The extension part has a vertical height that is greater than its horizontal width.