Semiconductor Package Heat Spreading Structure for Thermal Management

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Solution Overview

Problem

Semiconductor device packages face challenges in efficient heat dissipation as they generate more heat with improved functionality, and increasing the package size to enhance heat dispersion increases costs and sacrifices PCB area usage.

Innovation Solution

A semiconductor device package design featuring a substrate with a supporting structure and a heat spreading structure that extends beyond the substrate's lateral surface, providing an enhanced heat dissipation area without increasing the package size, using materials like aluminum, copper, or other conductive materials with adhesive layers for efficient heat transfer.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If the size of the device package is increased to enhance heat dispersion, then heat dissipation efficiency is improved, but manufacturing cost increases and PCB area usage is sacrificed

Engineering Contradiction:

Improveheat dissipation efficiencyVSAvoidPCB area usage

Core Design Contradiction:

TemperatureVSArea of stationary object

Solution Approach 1:

The patent extends the heat spreading structure laterally beyond the substrate boundaries into the surrounding space, utilizing the third dimension (lateral extension) to increase heat dissipation area without proportionally increasing the footprint on the PCB. This dimensional transition allows heat to spread in directions other than the planar substrate surface.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The device package is segmented into distinct functional components: the substrate for electronic components, the supporting structure for mechanical stability, and the heat spreading structure for thermal management. This segmentation allows each component to be optimized independently, with the heat spreading structure specifically designed to extend laterally for enhanced heat dissipation without requiring the entire package to be larger.

Inventive Principle:

Principle #1Segmentation

2Temperature

If the size of the device package is increased to enhance heat dispersion, then heat dissipation efficiency is improved, but manufacturing cost increases

Engineering Contradiction:

Improveheat dissipation efficiencyVSAvoidmanufacturing cost

Core Design Contradiction:

TemperatureVSEase of manufacture

Solution Approach 1:

The supporting structure serves multiple functions simultaneously: it provides mechanical support for the substrate and electronic components, and it acts as the heat spreading structure for thermal management. This multi-functionality eliminates the need for a separate heat sink component, reducing part count and assembly complexity while maintaining effective heat dissipation.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Solution Approach 2:

The patent merges the supporting structure and heat spreading structure into a single integrated component. The supporting structure is designed to laterally surround and support the substrate while simultaneously functioning as the heat spreading structure, combining structural and thermal management functions into one element to reduce manufacturing cost.

Inventive Principle:

Principle #5Merging (Combining)

3Reliability

If a larger heat spreading area is used to reduce heat resistance, then heat dissipation efficiency is improved, but the package size increases

Engineering Contradiction:

Improveheat dissipation efficiencyVSAvoidpackage size

Core Design Contradiction:

ReliabilityVSLength of stationary object

Solution Approach 1:

The heat spreading structure transitions from a planar configuration confined to the substrate surface to a three-dimensional configuration that extends laterally beyond the substrate boundaries. This dimensional change increases the effective heat dissipation surface area without proportionally increasing the package footprint, as the heat spreading occurs in the lateral direction surrounding the substrate.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The heat spreading structure is strategically positioned to laterally surround the substrate at specific regions where heat dissipation is most needed, rather than uniformly expanding the entire package. This localized heat spreading approach increases heat dissipation efficiency in critical areas while maintaining a compact overall package size.

Inventive Principle:

Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design effectively reduces heat resistance and achieves efficient heat dissipation by utilizing a larger heat spreading structure and supporting structure, maintaining a compact package size while minimizing cost and PCB area usage.

Implementation Method 1

heat spreading structure disposed on the supporting structure... utilizing a larger heat spreading structure and supporting structure, maintaining a compact package size while minimizing cost and PCB area usage

Methodology Applied

Scientific EffectHeat conduction: Conduction (thermal)

Data Source

PatentUS11217502B2Semiconductor device packages and methods of manufacturing the same

Publication Date: 2022.01.04 ADVANCED SEMICON ENG INC

AI summary

A semiconductor device package includes a substrate, an electronic component disposed on the substrate, a supporting structure disposed on the substrate and surrounding the electronic component, and a heat spreading structure disposed on the supporting structure. A length of the supporting structure and a length of the heat spreading structure are greater than a length of the substrate.