Semiconductor Housing Concave Convex Stacking Protection
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Solution Overview
Problem
Conventional semiconductor devices face challenges in maintaining the visibility and integrity of identification information on their housing surfaces, which can become damaged or stained, leading to difficulties in identification and potential discarding of functional devices.
Innovation Solution
The semiconductor device features a housing with concave and convex portions on opposing surfaces, ensuring that identification information is protected and remains legible even when devices are stacked, by maintaining clearance between surfaces and preventing direct contact that could cause damage or staining.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If devices are stacked for efficient transportation and storage, then transportation efficiency is improved, but identification information on housing surfaces may become damaged or stained
Solution Approach 1:
The housing surface is segmented into a first surface and a second surface separated by a predetermined distance in the thickness direction. Identification information is selectively provided on one of these surfaces, ensuring that when devices are stacked, the identification surface does not directly contact with adjacent devices, preventing damage while maintaining transportation efficiency.
2Loss of information
If identification information is provided on the housing surface, then device identification is enabled, but the surface may become damaged or stained when devices are stacked
Solution Approach 1:
A protective structure is designed in advance by separating the first surface (with identification information) and the second surface by a predetermined distance. This pre-established separation acts as a buffer that prevents direct contact between stacked devices, thereby protecting the identification information from damage before stacking occurs.
Solution Approach 2:
When the first surface is provided with identification information, a corresponding convex portion is formed on the second surface at the same position. This creates a protective counterpart structure that maintains the identification information's integrity by preventing direct exposure of the marked surface during stacking operations.
3Reliability
If convex portions are added to protect identification information, then identification integrity is improved, but device complexity increases
Solution Approach 1:
The convex portions on the second surface serve multiple functions: they protect the identification information on the first surface by preventing direct contact, and simultaneously act as positioning or engagement features when devices are stacked. This multi-functionality reduces the need for additional separate protective components, thereby limiting the increase in device complexity.
Data Source
AI summary
A semiconductor device having a housing is provided, where the housing includes the first surface, concave portions provided to the first surface, the second surface to face toward the first surface, and convex portions provided in contact with the second surface. In a thickness direction of the housing directed from the first surface to the second surface, the concave portions and the convex portions are provided at positions corresponding to each other.