Semiconductor IC Lifetime Prediction by Cumulative Heat Exposure
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Solution Overview
Problem
Existing semiconductor integrated circuits, such as MCUs, lack effective means to predict and prevent wear-out failures due to aged deterioration, especially in high-temperature environments, and current temperature monitoring functions are limited to operational periods, failing to monitor temperatures when the system is inactive.
Innovation Solution
A semiconductor integrated circuit incorporating a processor, temperature sensor, and non-volatile memory formed on the same substrate, which compares measured temperatures with thresholds and accumulates time exceeding these thresholds, providing warnings when cumulative high-temperature exposure approaches critical levels, enabling predictive maintenance and operational restrictions to prevent wear-out.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the MCU operates continuously in high-temperature environments, then the device can perform its intended function, but the cumulative operating time leads to wear out failure
Solution Approach 1:
The patent applies preliminary action by accumulating high-temperature exposure time data before wear-out failure occurs. The system continuously monitors and accumulates the duration when temperature exceeds the threshold during normal operation, enabling predictive maintenance and preventive measures before the cumulative time reaches the wear-out threshold, thus resolving the contradiction between maintaining operational reliability and extending device lifetime
Solution Approach 2:
The patent implements feedback by continuously monitoring the accumulated high-temperature operating time and comparing it against the predetermined threshold. When the accumulated time exceeds the threshold, the system provides feedback through wear-out failure prediction information output, enabling real-time adjustment of operational parameters or preventive maintenance actions to balance operational needs with device longevity
2Use of energy by moving object
If the MCU stops operation during battery charge in hybrid vehicles, then power consumption is reduced, but the device remains exposed to high temperature causing wear out failure
Solution Approach 1:
The patent applies self-service by enabling the temperature monitoring and accumulation function to operate independently of the main MCU operational state. The temperature sensor and accumulation circuit continue to track high-temperature exposure even when the MCU is in low-power mode during battery charging, allowing the system to self-monitor harmful thermal exposure without requiring full operational power consumption
3Measurement precision
If existing temperature monitoring functions are used, then operational temperature can be monitored, but they cannot predict lifetime due to aged deterioration
Solution Approach 1:
The patent resolves this contradiction by performing preliminary accumulation of high-temperature exposure time during normal operation. The system continuously integrates the duration of high-temperature conditions into an accumulated time value, which serves as a predictive indicator for wear-out failure. This preliminary data accumulation transforms basic temperature monitoring into a comprehensive lifetime prediction capability without requiring additional sensors or complex measurements
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables the prediction of MCU lifetime and timely notification of potential wear-out failures, ensuring extended operational reliability by monitoring and managing temperature exposure even when the system is inactive, thereby preventing premature failures.
Implementation Method 1
a temperature sensor 1, formed on the same semiconductor substrate as the MCU 20
Implementation Method 2
a comparator 10, which compares a temperature measured by the temperature sensor 1 with a predetermined temperature threshold
Implementation Method 3
a non-volatile memory 5, which accumulatively holds information about a period with the temperature exceeding the temperature threshold
Data Source
AI summary
In order to provide a semiconductor integrated circuit capable of predicting its own lifetime (wear out failure) due to the aged deterioration and notifying a warning, it includes a processor, a temperature sensor, a non-volatile memory, and a comparator formed on the same semiconductor substrate. The comparator compares a temperature measured by the temperature sensor with a predetermined temperature threshold, and the non-volatile memory accumulatively holds the information (cumulative time) about a period having the temperature exceeding the temperature threshold. The semiconductor integrated circuit notifies the outward of a warning when the cumulative time having the temperature exceeding the temperature threshold exceeds a predetermined high temperature time threshold.